Program Overview
Keynote Talks
Title : Advanced Package FAB solutions for Next Generation Devices
Speaker: Seung Wook Yoon, Corporate VP/Head of Team of Package Technology
Strategy and Planning, – Samsung Electronics
Speaker: Eric Beyne,
Senior Fellow, VP R&D, Director 3D System Integration
Technology Talks
Speaker: Gamal Refai-Ahmed, LFASME, FIEEE, FCAE, FEIC, Xilinx Fellow
2.Packaging materials
as a key enabler for future megatrends
Speaker: Klemens Brunner, President, Heraeus Electronics
3.Innovative Copper Electrodeposition Solutions for High Density Fanout (HDFO) Package Technology
Speaker: Bryan Buckalew, Technical Director, Lam Research Corporation, USA
4.Hybrid Bonding - State of the art and upcoming requirements
Speaker: Paul Linder, Executive Director, EV Group
5. To be announced
Speaker: Jinho An, Technology Director, Applied Materials
Panel Discussion
Panel topic: Supply Chain Ecosystem Challenges Impacting Global Electronic Packaging
Chair: Kitty Pearsall, IEEE-EPS, President Elect
Panel Speakers: C. P. Hung (ASE), Chun Ho (Nelson) Fan (ASM PT), Jan
Vardenman (TechSearch International) and TBD (Global Foundries)
This Panel will cover supply chain trends (e.g. convergence, mergers, and acquisitions), material shortages, equipment limitations, manufacturing capacity, and disruptions (e.g., geopolitical, natural & human resources, regulatory & Environmental Health and Safety). Each of these factors must be taken into consideration when making technical and business decisions. Exacerbating these challenges is the COVID pandemic
Workshop
Heterogeneous Integration Roadmap (HIR)
The Heterogeneous
Integration Roadmap (HIR), released in October 2019, is a roadmap to the future
of electronics packaging, identifying technology requirements and potential
solutions. The primary objective is to stimulate pre-competitive collaboration
between industry, academia, and government to accelerate progress. The roadmap
offers professionals, industry, academia, and research institutes a
comprehensive, strategic technology forecast over the next 15 years. The HIR
also delivers a 25-year projection for heterogeneous integration of Emerging
Research Devices and Emerging Research Materials with more comprehensive research
and development timelines. Details of
the HIR Workshop at EPTC 2021 will be finalized soon
