AWARDS

Best Paper Categories for EPTC 2015

1) Best Industry Paper (Cash award SGD1500)
2) Best Academic Paper (Cash award SGD1500)
3) Best Interactive Paper (Cash award SGD1000)


2013 Best Paper Award Winners

1) Best Industry Paper (Cash award SGD1500)

High Density Chip-to-wafer Integration using Self-assembly: On the Performances of Directly Interconnected Structures made by Direct Copper/Oxyde Bonding
S. Mermoz, L. Sanchez, L. Di Cioccio, J. Berthier, E. Deloffre, P. Coudrain and C. Fretigny
ST Microelectronics & CEA Minatec Campus

2) Best Academic Paper (Cash award SGD1500)

Microstructure Investigation of Cu/SnAg Solid-Liquid Interdiffusion Interconnects by Electron Backscatter Diffraction
Iuliana Panchenko, Juergen Grafe, Maik Mueller and Klaus-Juergen Wolter
TU Dresden

3) Best Poster Paper (Cash award SGD1000)

Study on Dynamic Modeling and Reliability Analysis of Wafer Thinning Process for TSV Wafer
F. X. Che, W. S. Vincent Lee and Xiaowu Zhang
IME, A*STAR, Singapore

top