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ABOUT EPTC

The 17th Electronics Packaging Technology Conference (EPTC 2015) is an International event organized by the IEEE Reliability/CPMT/ED Singapore Chapter and sponsored by IEEE CPMT Society.

EPTC 2015 will feature technical sessions, short courses/forums, an exhibition, social and networking activities. It aims to provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.

Since its inauguration in 1997, EPTC has developed into a highly reputed electronics packaging conference in Asia and is well attended by experts in all aspects related to packaging technology from all over the world. EPTC is the leading flagship conference of CPMT Society in Region 10.

CONFERENCE TOPICS

You are invited to submit an abstract, presenting new development in the following categories:

  • Advanced Packaging: Flip-chip and wire-bond packaging, embedded passives and actives on substrates, 3D System in Packaging, etc.
  • TSV/Wafer Level Packaging: Wafer level packaging ( Fan in / Fan out ), embedded chip packaging, 2.5D/3D integration, TSV, Silicon & Glass interposer, RDL, bumping technologies, etc.
  • Interconnection Technologies: Au/Ag/Cu/Al Wire-bond / Wedge bond technology, Flip-chip & Cu pillar technology, solder alternatives (ICP, ACP, ACF, NCP, ICA), Cu to Cu, Wafer level bonding & die attachment (Pb-free) etc.
  • Emerging Technologies: Packaging technologies for MEMS, biomedical, optoelectronics, Internet of things, photo voltaic, printed electronics, wearable electronics, Photonics, LED, etc.
  • Materials & Processes: Materials and processes for traditional and advanced microelectronic systems, MEMS, solar, green and biomedical packaging.
  • Electrical Modeling & Simulations: Power plane modeling, signal integrity analysis of substrate/package.
  • Mechanical Modeling & Simulations: Thermo-mechanical, moisture, fracture, fatigue, vibration, Shock and drop impact modeling, Chip-package interaction, etc.
  • Thermal Characterization & Cooling Solutions: TThermal modeling and simulation, component, system and product level thermal management and characterization.
  • Quality & Reliability: Component, board, system and product level reliability assessment, Interfacial adhesion, accelerated testing, failure characterization, etc.
  • Wafer/Package level & TSV Testing and Characterization: High-speed test architectures and systems design, 2.5D & 3D test methodologies, probe card design, package-test interaction, high-throughput testing etc.
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