Advanced Packaging

Navas KHAN, TC Chair

Infineon Technologies, Singapore

Min Woo RHEE, TC Co-Chair

Samsung Electronics, South Korea

Rainer DUDEK, TC Member

Fraunhofer ENAS, Germany

V C Muniandy KESVAKUMAR,

TC Member , Infineon Technologies, Singapore

Aditya KUMAR, TC Member

GlobalFoundries, USA

Jean-Charles SOURIAU, TC Member

CEA-LETI, France

C.S. FOONG, TC Member

NXP Semiconductor, Netherlands

Bok Eng CHEAH, TC Member

Intel, USA

Hyoung Joon KIM, TC Member

Qualcomm, USA

Nagendra Sekhar VASARLA, TC Member

Institute of Microelectronics, Singapore

Karsten MEIER, TC Member

TU Dresden, Germany

Thorsten MEYER, TC Member

Infineon Technologies, Germany

TSV/Wafer Level Packaging

Seung Wook YOON,

TC Chair

Samsung Electronics, South Korea

Mark HUANG, TC Co-Chair

Suzhou SPEED Semiconductor Technology Pte Ltd, China

Ranjan RAJOO, TC Member

GlobalFoundries, Singapore

Kuoming CHEN, TC Member

UMC, Taiwan

Gaurav SHARMA, TC Member

GlobalFoundries, USA

Seung Taek YANG, TC Member

SK Hynix, South Korea

Jaesik LEE, TC Member

Nvidia, USA

Mingliang HUANG, TC Member

Dalian University of Technology, China

Boo Yang JUNG, TC Member

SK Hynix, South Korea

Thorsten MEYER, TC Member

Infineon Technologies, Germany

Steffen KROEHNERT, TC Member

ESPAT-Consulting, Germany

Yann GUILLOU, TC Member

Trymax Semiconductor, Netherlands

Gao SHAN, TC Member

Huawei International, Singapore

Chee Ping LEE, TC Member

Lam Research, Singapore

Wei ZHOU, TC Member

Micron Technology, USA

Rama Krishna KOTLANKA, TC Member

Analog Devices, USA

Sungdong KIM, TC Member

Seoul National University of Science and Technology, South Korea

Hemanth Kumar Cheemalamarri

Institute of Microelectronics, Singapore 

Assembly and Manufacturing Technology

Ranjan RAJOO, TC Chair

GlobalFoundries, Singapore

Chandra BHESETTI, TC Co-Chair

Institute of Microelectronics, Singapore

Yunbo HE, TC Member

Guangdong University of Technologies, China

Prayudi LIANTO, TC Member

Applied Materials, Singapore

Chee Ping LEE, TC Member

Lam Research, Singapore

Rathin MANDAL, TC Member

Institute of Microelectronics, Singapore

Haruchi KANAYA, TC Member

Kyushu University, Japan

Dongshun BAI, TC Member

Brewer Science, Singapore

Eric J.R. PHUA, TC Member

Nanofilm Technologies International, Singapore

Tingyu Leon LIN, TC Member

Guangdong Fozhixin Microelectronics Research, China

Quality, Reliability & Failure Analysis

Alfred YEO, TC Chair

Advanced Micro Devices, Singapore

Ming XUE, TC Co-Chair

Infineon Technologies, Singapore

Christian BIRZER, TC Member

Infineon Technologies, Germany

Xuejun FAN, TC Member

Lamar University, USA

Keith NEWMAN, TC Member

Advanced Micro Devices, Singapore

Hong Wan NG, TC Member

Micron Semiconductor, Singapore

Shaw Fong WONG, TC Member

Intel, Malaysia

Chin Hui CHONG, TC Member

Micron Technology, Singapore

Lei Jun TANG, TC Member

Institute of Microelectronics, Singapore

Ai Kiar ANG, TC Member

IBM, Singapore

Haohui LONG, TC Member

Huawei Technologies., China

Stevan G HUNTER, TC Member

Arizona State University, USA

Interconnection Technologies

Liming SHEN, TC Chair

Kulicke & Soffa, Singapore

Hong Meng HO, TC Co-Chair

Infineon Technologies, Singapore

Horst CLAUBERG, TC Member

Kulicke & Soffa, USA

Wei FAN, TC Member

Singapore Institute of Manufacturing Technology, Singapore

Nga Phuong PHAM, TC Member

IMEC, Belgium

Daquan YU, TC Member

Chinese Academy of Science, China

David HUTT, TC Member

Loughborough University, UK

Jack XIONG, TC Member

Qorvo, Singapore

Tanemasa ASANO, TC Member

Kyushu University, Japan

Kyung W. PAIK, TC Member

KAIST, South Korea

Lois LIAO, TC Member

Wintech Nano-Technology Services, Singapore

Lam WAI, TC Member

Nexperia, Hong Kong

Serguei STOUKATCH, TC Member

Liege University, Belgium

Electrical Simulations & Characterization

Mihai ROTARU, TC Chair

Institute of Microelectronics, Singapore

Bruce KIM, TC Co-Chair

City University of New York, USA

Aoyagi MASAHIRO, TC Member

AIST, Japan

Weerasekera ROSHAN, TC Member

University of the West of England, UK

Arif ENGIN, TC Member

San Diego State University, USA

Fujiang LIN, TC Member

USTC, China

Jianyong XIE, TC Member

Intel, USA

Chetan VERMA, TC Member

NXP Semiconductors, India

Fei GOU, TC Member

Advanced Micro Devices, Canada

Jackson KONG, TC Member

Intel, Malaysia

Sungho KANG, TC Member

Yonsei University, South Korea

En-Xiao LIU, TC Member

Institute of High Performance Computing, Singapore

Mechanical Simulation & Characterization

Andrew TAY, TC Chair

National University of Singapore, Singapore

Shan GAO, TC Co-Chair

Huawei Technologies, Singapore

Kuo Ning CHIANG, TC Member

National Tsing Hua University, Taiwan

Juergen AUERSPERG, TC Member

Fraunhofer ENAS, Germany

Wei ZHOU, TC Member

Micron Technology, Singapore

Richard RAO, TC Member

Marvell Technology, USA

Xiaowu ZHANG, TC Member

Institute of Microelectronics, Singapore

Christopher BAILEY, TC Member

University of Greenwich, UK

Rathin MANDAL, TC Member

Institute of Microelectronics, Singapore

Yong LIU, TC Member

ON Semiconductor, USA

Jeff SUHLING, TC Member

University of Auburn, USA

Rainer DUDEK, TC Member

Fraunhofer ENAS, Germany

Ah-Young PARK, TC Member

Korea Institute of Machinery and Materials, South Korea

Qiang YU, TC Member

Yokohama National University, Japan

SB Park, TC Member

Binghamton University, USA

Advanced Optoelectronics and Displays

Haohui LONG , TC Chair

Huawei Technologies, China       

Wenhui ZHU, TC Co-Chair

Central South University, China

Jianhua ZHANG, TC Member     

Shanghai University, China

Xueren ZHANG, TC Member          

Xilinx, Singapore

Zhang LI, TC Member  

Huawei Technologies, China       

Zheng GONG, TC Member  

Guangdong Institute of Semiconductor Industrial Technology, China

Nagendra Sekhar VASARLA, TC Member

Institute of Microelectronics, Singapore

Horst CLAUBERG, TC Member

Kulicke & Soffa, USA

Wolfgang REINERT, TC Member

Fraunhofer Institute for Silicon Technology, Germany

Liancheng WANG, TC Member

Central South University, China

Zi-Hui ZHANG, TC Member

Hebei University of Technology, China

Xiaoyan YI, TC Member

Institute of Semiconductor, China

Anlian PAN, TC Member

Hunan University, China

Sung-Min LEE, TC Member

Kookmin University, South Korea

Yang ZHOU, TC Member

Wuhan University, China

Xuan CAO, TC Member

Chengdu Vistar Optoelectronics, China

Emerging Technologies

Kripesh VAIDYANATHAN,

TC Chair

Institute of Technical Education, Singapore

Martin OPPERMANN,

TC Co-Chair

Dresden University of Technology, Germany

Perceval COUDRAIN, TC Member

CEA-LETI, France

Toni MATTILA, TC Member

Aalto University Espoo, Finland

Nga Phuong PHAM. TC Member

IMEC, Belgium

Wolfgang REINERT, TC Member

Fraunhofer Institute for Silicon Technology, Germany

Thomas ZERNA, TC Member

Dresden University of Technology, Germany

Yufeng YAO, TC Member

Broadcom, Singapore

Rama Krishna KOTLANKA, TC Member

Analog Devices, USA

Suan Hui PU, TC Member

University of Southampton, Malaysia

Piotr Mackowiak

Fraunhofer IZM

Jae OK

Institute of Microelectronics, Singapore

Materials and Processing

Chin Hock TOH, TC Chair

Packaging Professional, Singapore

Alvin LEE, TC Co-Chair

Brewer Science, Taiwan

Chee Lip GAN, TC Member

Nanyang Technological University, Singapore

Sungdong KIM, TC Member

Seoul National University of Science & Technology, South Korea

Kim Shyong SIOW, TC Member

Universiti Kebangsaan Malaysia, Malaysia

Changqing LIU, TC Member

Loughborough University, UK

Vempati Srinivasa RAO, TC Member

Institute of Microelectronics, Singapore

Suan Hui PU, TC Member

University of Southampton, Malaysia

Yu-Po WANG, TC Member

Siliconware Precision Industries, Taiwan

SS KANG, TC Member

Heraeus, Singapore

An XIAO, TC Member

Ampleon, Netherlands

Lewis HUANG, TC Member

Senju Metal Industry, Taiwan

Santosh Kumar RATH, TC Member

Applied Materials, Singapore

Albert LAN, TC Member

Applied Materials, Taiwan

Po Hao TSAI, TC Member

DuPont, Taiwan

Thermal Management and Characterization

Rathin MANDAL, TC Chair

Institute of Microelectronics, Singapore

Marta RENCZ, TC Co-Chair

Mentor Graphics - MicReD, Hungary

Yogendra JOSHI, TC Member

Georgia Institute of Technology, USA

Justin A. WEIBEL, TC Member

Purdue University, USA

Hengyun ZHANG, TC Member

Shanghai University of Engineering Science, China

Marcin JANICKI, TC Member

Lodz University of Technology, Poland

Yong HAN, TC Member

Institute of Microelectronics, Singapore

Kazuyoshi FUSHINOBU, TC Member

Tokyo Institute of Technology, Japan

Ye HONG, TC Member

University of Science and Technology, China

Codecasa LORENZO, TC Member

Politecnico di Milano, Italy

Pengfei LI, TC Member

Huawei Technologies, China

Shankar S, TC Member

Shiretechnik Solutions, India

Yan XU, TC Member

Huawei Technologies, China

Shreyas BINDIGANAVALE, TC Member

Advanced Micro Devices, Singapore

Gamal REFAI-AHMED, TC Member

Xilinx, USA

Andy WANG, TC Member

Xilinx, USA

Tiwei WEI, TC Member

Stanford University, USA

Smart Manufacturing & Equipment Technology

Chandra BHESETTI, TC Chair

Institute of Microelectronics, Singapore

Arthur WEE, TC Member

Infineon Technologies, Singapore

Wint PHYU, TC Member

Kulicke & Soffa, Singapore

Ai Kiar ANG, TC Member

IBM, Singapore

Tick Kwang LOH, TC Member

Kulicke & Soffa, Singapore 

Ephraim SUHIR, TC Member

Portland State University, USA