Advanced Packaging

Navas KHAN, TC Chair

Infineon Technologies, Singapore

Daniel RHEE, TC Co-Chair

Samsung Electronics, South Korea

Rainer DUDEK, TC Member

Fraunhofer ENAS, Germany

V C Muniandy KESVAKUMAR, TC Member

Infineon Technologies, Singapore

Aditya KUMAR, TC Member

GlobalFoundries Inc.

Jean-Charles SOURIAU, TC Member

CEA-LETI, France

C.S. FOONG, TC Member

NXP Semiconductors, N.V.

Bok Eng CHEAH, TC Member

Intel Corporation, Malaysia

Nagendra Sekhar VASARLA, TC Member

Institute of Microelectronics, Singapore

Karsten MEIER, TC Member

TU Dresden, Germany

Thorsten MEYER, TC Member

Infineon Technologies, Germany

Miao WANG, TC Member

NXP Semiconductors, N.V.

TSV/Wafer Level Packaging

Thorsten Meyer, TC Chair

Infineon Technologies AG

King Jien CHUI, TC Co-Chair

Samsung, Singapore

Ranjan RAJOO, TC Member

GlobalFoundries, Singapore

Kuoming CHEN, TC Member

United Microelectrics Corporation, Taiwan

Gaurav SHARMA, TC Member

NXP Semiconductors, N.V.

Seung Taek YANG, TC Member

SK Hynix, South Korea

Mingliang HUANG, TC Member

Dalian University of Technology, China

Boo Yang JUNG, TC Member

SK Hynix, South Korea

Gao Shan, TC Member

Taiwan Semiconductor Manufacturing Company

Steffen KROEHNERT, TC Member

ESPAT-Consulting, Germany

Chee Ping LEE, TC Member

LAM Research, Singapore

Wei ZHOU, TC Member

Micron Technology Inc., USA

Rama Krishna KOTLANKA, TC Member

Analog Devices Inc., USA

Sungdong KIM, TC Member

Seoul National University of Science and Technology, South Korea

Soon Aik CHEW

Interuniversity Microelectronics Center, Belgium

Peng ZHAO

Interuniversity Microelectronics Center, Belgium

Assembly and Manufacturing Technology

Ranjan RAJOO, TC Chair

GlobalFoundries, Singapore

Chandra BHESETTI, TC Co-Chair

Institute of Microelectronics, Singapore

Prayudi LIANTO, TC Member

Applied Materials, Singapore

Chee Ping LEE, TC Member

Lam Research, Singapore

Rathin MANDAL, TC Member

Institute of Microelectronics, Singapore

Haruchi KANAYA, TC Member

Kyushu University, Japan

Dongshun BAI, TC Member

Brewer Science, Singapore

Eric PHUA, TC Member

Nanofilm Technologies Intl Ltd, Singapore

Tingyu Leon LIN, TC Member

Guangdong Fozhixin Microelectronics Research, China

Raymond HUNG, TC Member

Applied Materials, Singapore

Nandini VENKATARAMEN, TC Member

Institute of Microelectronics, Singapore

Yeow Kheng LIM, TC Member

National University of Singapore

Quality, Reliability & Failure Analysis

Xueren ZHANG, TC Chair

Advanced Micro Devices, Singapore

Ming XUE, TC Co-Chair

Infineon Technologies, Singapore

Christian BIRZER, TC Member

Infineon Technologies, Germany

Xuejun FAN, TC Member

Lamar University, USA

Keith NEWMAN, TC Member

Advanced Micro Devices, Singapore

Hong Wan NG, TC Member

Micron Semiconductor, Singapore

Shaw Fong WONG, TC Member

Intel Corporation, Malaysia

Chin Hui CHONG, TC Member

Micron Technology, Singapore

Lei Jun TANG, TC Member

Institute of Microelectronics, Singapore

Ai Kiar ANG, TC Member

IBM, Singapore

Haohui LONG, TC Member

Huawei Technologies, China

Stevan G HUNTER, TC Member

Arizona State University, USA

Jing-En LUAN, TC Member

ST Microelectronics, Singapore

Interconnection Technologies

Alfred YEO, TC Chair 

STATSChipPAC, Singapore

Lois Liao, TC Co-Chair

Wintech Nano-Technology Services, Singapore

Horst CLAUBERG, TC Member

Kulicke & Soffa Industries Inc., USA

Liming SHEN, TC Member

Kulicke & Soffa Industries Inc., USA

Wei FAN, TC Member

Singapore Institute of Manufacturing Technology, Singapore

Nga Phuong PHAM, TC Member

Interuniversity Microelectronics Center, Belgium

Daquan YU, TC Member

Chinese Academy of Science, China

Jack XIONG, TC Member

Qorvo Inc., Singapore

Tanemasa ASANO, TC Member

Kyushu University, Japan

Chuan Seng TAN, TC Member

Institue of Microelectronics, Singapore

Lam WAI, TC Member

Nexperia B.V., Hong Kong

Serguei STOUKATCH, TC Member

Liege University, Belgium

Chee Sing CHIN, TC Member

Kulicke and Soffa Industries, Inc.

Shu Ye ZHANG, TC Member

Harbin Institute of Technology

Vivek Chidambaram, TC Member

Intel, Singapore

Electrical Simulations & Characterization

Mihai ROTARU, TC Chair

Institute of Microelectronics, Singapore

Bruce KIM, TC Co-Chair

City University of New York, USA

Aoyagi MASAHIRO, TC Member

National Institute of Advanced Industrial Science and Technology, Japan

Weerasekera ROSHAN, TC Member

University of the West of England, UK

Arif ENGIN, TC Member

San Diego State University, USA

Fujiang LIN, TC Member

University of Science and Technology, China

Jianyong XIE, TC Member

Intel Corporation, USA

Chetan VERMA, TC Member

NXP Semiconductors N.V., India

Fei GOU, TC Member

Advanced Micro Devices, Canada

Jackson KONG, TC Member

Intel, Malaysia

Sungho KANG, TC Member

Yonsei University, South Korea

En-Xiao LIU, TC Member

Institute of High Performance Computing, Singapore

Mechanical Simulation & Characterization

Andrew TAY, TC Chair

National University of Singapore, Singapore

Kuo Ning CHIANG, TC Co-Chair

National Tsing Hua University, Taiwan

Xiaowu ZHANG, TC Member

Institute of Microelectronics, Singapore

Christopher BAILEY, TC Member

Arizona State University, USA

Jeff SUHLING, TC Member

University of Auburn, USA

Jiantao ZHENG, TC Member

HiSilicon Co., China

SB Park, TC Member

Binghamton University, USA

Roseanne DUCA, TC Member 

STMicroelectronics

Sasi Kumar TIPPABHOTLA, TC Member

Institute of Microelectronics, Singapore

HC CHENG, TC Member

Feng Chia University, Taiwan

Faxing CHE, TC Member

Micron Technology, Singapore

Willem van DRIEL, TC Member

Technical University in Delft, Netherlands 

Rathin MANDAL, TC Member

Institute of Microelectronics, Singapore

Advanced Optoelectronics and Displays

Nagendra Sekhar VASARLA, TC Chair

Institute of Microelectronics, Singapore

Wenhui ZHU, TC Co-Chair

Central South University, China

Jianhua ZHANG, TC Member     

Shanghai University, China

Haohui LONG , TC Member

Huawei Technologies, China       

Zhang LI, TC Member  

Huawei Technologies, China

Zheng GONG, TC Member  

Guangdong Institute of Semiconductor Industrial Technology, China

Horst CLAUBERG, TC Member

Kulicke & Soffa Industries, USA

Wolfgang REINERT, TC Member

Fraunhofer Institute for Silicon Technology, Germany

Liancheng WANG, TC Member

Central South University, China

Zi-Hui ZHANG, TC Member

Hebei University of Technology, China

Xiaoyan YI, TC Member

Institute of Semiconductor, China

Anlian PAN, TC Member

Hunan University, China

Sung-Min LEE, TC Member

Kookmin University, South Korea

Yang ZHOU, TC Member

Wuhan University, China

Xuan CAO, TC Member

Chengdu Vistar Optoelectronics, China

Chun Hong KANG, TC Member

KAUST, Saudi Arabia

How Yuan HWANG, TC Member

Tyndall National Institute, UK

Emerging Technologies

Kripesh VAIDYANATHAN, TC Chair

Institute of Technical Education, Singapore

Martin OPPERMANN, TC Co-Chair

Dresden University of Technology, Germany

Perceval COUDRAIN, TC Member

CEA-LETI, France

Toni MATTILA, TC Member

Aalto University Espoo, Finland

Nga Phuong PHAM, TC Member

Interuniversity Microelectronics Centre, Belgium

Wolfgang REINERT, TC Member

Fraunhofer Institute for Silicon Technology, Germany

Thomas ZERNA, TC Member

Dresden University of Technology, Germany

Yufeng YAO, TC Member

Broadcom Inc., Singapore

Rama Krishna KOTLANKA, TC Member

Analog Devices inc., USA

Piotr MACKOWIAK, TC Member

Fraunhofer Institute for Reliability and Microintegration, Germany

Vincent LEONG, TC Member

DSO National Laboratories, Singapore

Materials and Processing

Alvin LEE, TC Chair

Brewer Science Inc., Taiwan

Chin Hock TOH, TC Co-Chair

Lam Research, Singapore

Sungdong KIM, TC Member

Seoul National University of Science & Technology, South Korea

Kim Shyong SIOW, TC Member

Universiti Kebangsaan Malaysia, Malaysia

Changqing LIU, TC Member

Loughborough University, UK

Vempati Srinivasa RAO, TC Member

Institute of Microelectronics, Singapore

Suan Hui PU, TC Member

University of Southampton, Malaysia

Yu-Po WANG, TC Member

Siliconware Precision Industries, Taiwan

SS KANG, TC Member

Heraeus, Singapore

An XIAO, TC Member

Ampleon, Netherlands

Lewis HUANG, TC Member

Senju Metal Industry, Taiwan

Albert LAN, TC Member

Applied Materials Inc., Taiwan

Po-Hao TSAI, TC Member

Applied Materials Inc., Taiwan

Eric Phua, TC Member

Nanofilm Technologies Intl Ltd, Singapore

Lan PENG, TC Member

Interuniversity Microelectronics Centre, Belgium

Hemanth Kumar CHEEMALAMARRI, TC Member

Institute of Microelectronics, Singapore

Jie WU, TC Member 

Henkel, Singapore

Hsien-Wei CHEN, TC Member 

Taiwan Semiconductor Manufacturing Company, Taiwan

Po-Yao CHUANG, TC Member

Dupont, Taiwan

Takenori FUJIWARA, TC Member

Toray Industries Inc., Japan

Yu SHOJI, TC Member

Toray Industries Inc., Japan

Thermal Management and Characterization

Rathin MANDAL, TC Chair

Institute of Microelectronics, Singapore

Marta RENCZ, TC Co-Chair

Mentor Graphics - MicReD, Hungary

Yogendra JOSHI, TC Member

Georgia Institute of Technology, USA

Hengyun ZHANG, TC Member

Shanghai University of Engineering Science, China

Marcin JANICKI, TC Member

Lodz University of Technology, Poland

Yong HAN, TC Member

Institute of Microelectronics, Singapore

Kazuyoshi FUSHINOBU, TC Member

Tokyo Institute of Technology, Japan

Ye HONG, TC Member

University of Science and Technology, China

Codecasa LORENZO, TC Member

Politecnico di Milano, Italy

Shankar S, TC Member

Shiretechnik Solutions, India

Yan XU, TC Member

Huawei Technologies, China

Shreyas BINDIGANAVALE, TC Member

Advanced Micro Devices, Singapore

Gamal REFAI-AHMED, TC Member

Advanced Micro Devices, Singapore

Andy WANG, TC Member

Apple Inc., USA

Tiwei WEI, TC Member

Stanford University, USA

Sunmi SHIN, TC Member

National University of Singapore, Singapore

Gongyue TANG, TC Member

Institute of Microelectronics, Singapore

Martin OPPERMANN, TC Member

Dresden University of Technology, Germany

Smart Manufacturing & Equipment Technology

Chandra BHESETTI, TC Chair

Institute of Microelectronics, Singapore

Eric Phua, TC Co-Chair

Nanofilm Technologies Intl Ltd, Singapore

Arthur WEE, TC Member

Infineon Technologies, Singapore

Wint PHYU, TC Member

Kulicke & Soffa, Singapore

Ai Kiar ANG, TC Member

IBM, Singapore

Tick Kwang LOH, TC Member

Kulicke & Soffa, Singapore 

Leon Tingyu LIN, TC Member

Guangdong Fozhixin Microelectronics, China

Hongbin SHI, TC Member

Huawei Technologies, China

Sony VARGHESE, TC Member

Applied Materials Inc., USA

Sachin DANGAYACH, TC Member

Applied Materials Inc., USA

Zhigang DUAN, TC Member

MediaTek Inc., Singapore

Amit KUMAR, TC Member

Microsoft Corporation, India

Cheng YANG, TC Member

JCET Group, Singapore