Technical Committee
Advanced Packaging
Navas KHAN, TC Chair Infineon Technologies, Singapore
Daniel RHEE, TC Co-Chair Samsung Electronics, South Korea
Rainer DUDEK, TC Member Fraunhofer ENAS, Germany
V C Muniandy KESVAKUMAR, TC Member Infineon Technologies, Singapore
Aditya KUMAR, TC Member GlobalFoundries Inc.
Jean-Charles SOURIAU, TC Member CEA-LETI, France
C.S. FOONG, TC Member NXP Semiconductors, N.V.
Bok Eng CHEAH, TC Member Intel Corporation, Malaysia
Nagendra Sekhar VASARLA, TC Member Institute of Microelectronics, Singapore
Karsten MEIER, TC Member TU Dresden, Germany
Thorsten MEYER, TC Member Infineon Technologies, Germany Miao WANG, TC Member NXP Semiconductors, N.V. Andy Yong, TC Member Applied Materials Inc. Ksenija VARGA, TC Member EV Group
TSV/Wafer Level Packaging
Thorsten Meyer, TC Chair Infineon Technologies AG
King Jien CHUI, TC Co-Chair Samsung, Singapore
Ranjan RAJOO, TC Member GlobalFoundries, Singapore
Kuoming CHEN, TC Member United Microelectrics Corporation, Taiwan
Gaurav SHARMA, TC Member NXP Semiconductors, N.V.
Seung Taek YANG, TC Member SK Hynix, South Korea
Mingliang HUANG, TC Member Dalian University of Technology, China
Boo Yang JUNG, TC Member SK Hynix, South Korea
Gao Shan, TC Member Taiwan Semiconductor Manufacturing Company
Steffen KROEHNERT, TC Member ESPAT-Consulting, Germany
Chee Ping LEE, TC Member LAM Research, Singapore
Wei ZHOU, TC Member Micron Technology Inc., USA
Rama Krishna KOTLANKA, TC Member Analog Devices Inc., USA
Sungdong KIM, TC Member Seoul National University of Science and Technology, South Korea
Soon Aik CHEW Interuniversity Microelectronics Center, Belgium Assembly and Manufacturing Technology
Ranjan RAJOO, TC Chair GlobalFoundries, Singapore
Chandra BHESETTI, TC Co-Chair Institute of Microelectronics, Singapore Eric PHUA, TC Member Nanofilm Technologies Intl Ltd, Singapore
Yunbo HE, TC Member Guangdong University of Technologies, China
Prayudi LIANTO, TC Member Applied Materials, Singapore
Chee Ping LEE, TC Member Lam Research, Singapore
Rathin MANDAL, TC Member Institute of Microelectronics, Singapore
Haruchi KANAYA, TC Member Kyushu University, Japan
Dongshun BAI, TC Member Brewer Science, Singapore
Tingyu Leon LIN, TC Member Guangdong Fozhixin Microelectronics Research, China
Quality, Reliability & Failure Analysis
Xueren ZHANG, TC Chair Advanced Micro Devices, Singapore
Ming XUE, TC Co-Chair Infineon Technologies, Singapore
Christian BIRZER, TC Member Infineon Technologies, Germany
Xuejun FAN, TC Member Lamar University, USA
Keith NEWMAN, TC Member Advanced Micro Devices, Singapore
Hong Wan NG, TC Member Micron Semiconductor, Singapore
Shaw Fong WONG, TC Member Intel, Malaysia
Chin Hui CHONG, TC Member Micron Technology, Singapore
Lei Jun TANG, TC Member Institute of Microelectronics, Singapore
Ai Kiar ANG, TC Member IBM, Singapore
Haohui LONG, TC Member Huawei Technologies., China
Stevan G HUNTER, TC Member Arizona State University, USA
Shi Hongbin TC Member Huawei, China Eric PHUA, TC Member Nanofilm Technologies Intl Ltd, Singapore | Interconnection Technologies
Alfred YEO, TC Chair STATSChipPAC, Singapore
Lois Liao, TC Co-Chair Wintech Nano-Technology Services, Singapore
Horst CLAUBERG, TC Member Kulicke & Soffa Industries Inc., USA
Kulicke & Soffa Industries Inc., USA
Wei FAN, TC Member Singapore Institute of Manufacturing Technology, Singapore
Nga Phuong PHAM, TC Member Interuniversity Microelectronics Center, Belgium
Daquan YU, TC Member Chinese Academy of Science, China
Jack XIONG, TC Member Qorvo Inc., Singapore
Tanemasa ASANO, TC Member Kyushu University, Japan
Chuan Seng TAN, TC Member Institue of Microelectronics, Singapore
Lam WAI, TC Member Nexperia B.V., Hong Kong
Serguei STOUKATCH, TC Member Liege University, Belgium Chee Sing CHIN, TC Member Kulicke and Soffa Industries, Inc. Shu Ye ZHANG, TC Member Harbin Institute of Technology Vivek Chidambaram, TC Member Intel, Singapore Electrical Simulations & Characterization
Mihai ROTARU, TC Chair Institute of Microelectronics, Singapore
Bruce KIM, TC Co-Chair City University of New York, USA
Aoyagi MASAHIRO, TC Member National Institute of Advanced Industrial Science and Technology, Japan
Weerasekera ROSHAN, TC Member University of the West of England, UK
Arif ENGIN, TC Member San Diego State University, USA
Fujiang LIN, TC Member University of Science and Technology, China
Jianyong XIE, TC Member Intel Corporation, USA
Chetan VERMA, TC Member NXP Semiconductors N.V., India
Fei GOU, TC Member Advanced Micro Devices, Canada
Jackson KONG, TC Member Intel, Malaysia
Sungho KANG, TC Member Yonsei University, South Korea
En-Xiao LIU, TC Member Institute of High Performance Computing, Singapore
Mechanical Simulation & Characterization
Andrew TAY, TC Chair National University of Singapore, Singapore
Kuo Ning CHIANG, TC Co-Chair National Tsing Hua University, Taiwan
Roseanne DUCA, TC Member STMicroelectronics
Sasi Kumar TIPPABHAOTLA, TC Member A*STAR IME, Singapore
Wei ZHOU, TC Member Micron Technology, Singapore
Richard RAO, TC Member Marvell Technology, USA
Xiaowu ZHANG, TC Member Institute of Microelectronics, Singapore
Jan Albrecht, TC Member Fraunhofer ENAS
Rathin MANDAL, TC Member Institute of Microelectronics, Singapore
Yong LIU, TC Member ON Semiconductor, USA
Jeff SUHLING, TC Member University of Auburn, USA
Ah-Young PARK, TC Member Korea Institute of Machinery and Materials, South Korea
Sasi Kumar, TC Member Insitute of Microelectronics, Singapore
SB Park, TC Member Binghamton University, USA
Advanced Optoelectronics and Displays
Haohui LONG , TC Chair Huawei Technologies, China Wenhui ZHU, TC Co-Chair Central South University, China
Jianhua ZHANG, TC Member Shanghai University, China
Xueren ZHANG, TC Member Xilinx, Singapore
Zhang LI, TC Member Huawei Technologies, China Zheng GONG, TC Member Guangdong Institute of Semiconductor Industrial Technology, China
Nagendra Sekhar VASARLA, TC Member Institute of Microelectronics, Singapore
Horst CLAUBERG, TC Member Kulicke & Soffa, USA
Wolfgang REINERT, TC Member Fraunhofer Institute for Silicon Technology, Germany
Liancheng WANG, TC Member Central South University, China
Zi-Hui ZHANG, TC Member Hebei University of Technology, China
Xiaoyan YI, TC Member Institute of Semiconductor, China
Anlian PAN, TC Member Hunan University, China
Sung-Min LEE, TC Member Kookmin University, South Korea
Yang ZHOU, TC Member Wuhan University, China
Xuan CAO, TC Member Chengdu Vistar Optoelectronics, China |
|
|
Chun Hong KANG, TC Member KAUST, Saudi Arabia |
|
|
|
|
Emerging Technologies
Kripesh
VAIDYANATHAN, TC Chair Institute of Technical
Education, Singapore
Martin OPPERMANN, TC Co-Chair Dresden University of Technology,
Germany
Perceval COUDRAIN, TC Member CEA-LETI, France
Toni MATTILA, TC Member Aalto University Espoo, Finland
Nga Phuong PHAM. TC Member IMEC, Belgium
Wolfgang REINERT, TC Member Fraunhofer Institute for Silicon
Technology, Germany
Thomas ZERNA, TC Member Dresden University of Technology, Germany
Yufeng YAO, TC Member Broadcom, Singapore
Rama Krishna KOTLANKA, TC Member Analog Devices, USA
Piotr Mackowiak Fraunhofer IZM
DSO National Laboratories Materials and Processing
Chin Hock TOH, TC Chair Packaging Professional, Singapore Alvin LEE, TC Co-Chair Brewer Science, Taiwan
Sungdong KIM, TC Member Seoul National University of Science
& Technology, South Korea
Kim Shyong SIOW, TC Member Universiti Kebangsaan Malaysia, Malaysia
Changqing LIU, TC Member Loughborough University, UK
Vempati Srinivasa RAO, TC Member Institute of Microelectronics, Singapore
Suan Hui PU, TC Member University of Southampton, Malaysia
Yu-Po WANG, TC Member Siliconware Precision Industries,
Taiwan
SS KANG, TC Member Heraeus, Singapore
An XIAO, TC Member Ampleon, Netherlands
Lewis HUANG, TC Member Senju Metal Industry, Taiwan
Albert LAN, TC Member Applied Materials, Taiwan Po Hao TSAI, TC Member Applied Materials, Taiwan
Eric Phua, TC Member Nanofilm Technologies Intl Ltd, Singapore Lan PENG, TC Member IMEC, Belgium Hemanth Kumar CHEEMALAMARRI, TC Member IME, A*STAR, Singapore Wu Jie, TC Member HENKEL, Singapore Hsien- Wei Chen, TC Member NT Integration Department, TSMC, Taiwan Poyao Chuang Dupont, Taiwan Thermal Management and
Characterization
Rathin MANDAL, TC Chair Institute of Microelectronics, Singapore
Marta RENCZ, TC Co-Chair Mentor Graphics - MicReD, Hungary
Yogendra JOSHI, TC Member Georgia Institute of Technology, USA
Justin A. WEIBEL, TC Member Purdue University, USA
Hengyun ZHANG, TC Member Shanghai University of Engineering
Science, China
Marcin JANICKI, TC Member Lodz University of Technology, Poland
Yong HAN, TC Member Institute of Microelectronics, Singapore
Kazuyoshi FUSHINOBU, TC Member Institute of Science, Tokyo, Japan
Ye HONG, TC Member University of Science and Technology,
China
Codecasa LORENZO, TC Member Politecnico di Milano, Italy
Pengfei LI, TC Member Huawei Technologies, China
Shankar S, TC Member Shiretechnik Solutions, India
Yan XU, TC Member Huawei Technologies, China
Shreyas BINDIGANAVALE, TC Member Advanced Micro Devices, Singapore
Gamal REFAI-AHMED, TC Member Xilinx, USA
Andy WANG, TC Member Xilinx, USA
Tiwei WEI, TC
Member Stanford University, USA
Smart Manufacturing & Equipment
Technology
Chandra BHESETTI, TC Chair Institute of Microelectronics, Singapore Eric Phua, TC Co-Chair Nanofilm Technologies Intl Ltd, Singapore
Arthur WEE, TC Member Infineon Technologies, Singapore
Wint PHYU, TC
Member Kulicke &
Soffa, Singapore
Ai Kiar ANG, TC
Member IBM, Singapore
Tick Kwang LOH, TC
Member Kulicke &
Soffa, Singapore
Leon Tingyu LIN, TC Member Guangdong Fozhixin Microelectronics, China |