Technical Committee
Advanced Packaging
Navas KHAN, TC Chair Infineon Technologies, Singapore
Min Woo RHEE, TC Co-Chair Samsung Electronics, South Korea
Rainer DUDEK, TC Member Fraunhofer ENAS, Germany
V C Muniandy KESVAKUMAR, TC Member , Infineon Technologies, Singapore
Aditya KUMAR, TC Member GlobalFoundries, USA
Jean-Charles SOURIAU, TC Member CEA-LETI, France
C.S. FOONG, TC Member NXP Semiconductor, Netherlands
Bok Eng CHEAH, TC Member Intel, USA
Hyoung Joon KIM, TC Member Qualcomm, USA
Nagendra Sekhar VASARLA, TC Member Institute of Microelectronics, Singapore
Karsten MEIER, TC
Member TU Dresden,
Germany
Thorsten MEYER, TC Member Infineon Technologies, Germany
TSV/Wafer Level Packaging
Gao SHAN, TC Chair TSMC
King Jien CHUI, TC Co-Chair A*STAR IME, Singapore
Ranjan RAJOO, TC Member GlobalFoundries, Singapore
Kuoming CHEN, TC Member UMC, Taiwan
Gaurav SHARMA, TC Member GlobalFoundries, USA
Seung Taek YANG, TC Member SK Hynix, South Korea
Jaesik LEE, TC Member Nvidia, USA
Mingliang HUANG, TC Member Dalian University of Technology, China
Boo Yang JUNG, TC Member SK Hynix, South Korea
Thorsten MEYER, TC Member Infineon Technologies, Germany
Steffen KROEHNERT, TC Member ESPAT-Consulting, Germany
Yann GUILLOU, TC Member Trymax Semiconductor, Netherlands
Chee Ping LEE, TC Member Lam Research, Singapore
Wei ZHOU, TC Member Micron Technology, USA
Rama Krishna KOTLANKA, TC Member Analog Devices, USA
Sungdong KIM, TC Member Seoul National University of Science and
Technology, South Korea
Hemanth Kumar Cheemalamarri Institute of Microelectronics, Singapore Assembly and Manufacturing Technology
Ranjan RAJOO, TC Chair GlobalFoundries, Singapore
Chandra BHESETTI, TC Co-Chair Institute of Microelectronics, Singapore Eric PHUA, TC Member Nanofilm Technologies Intl Ltd, Singapore
Yunbo HE, TC Member Guangdong University of Technologies,
China
Prayudi LIANTO, TC Member Applied Materials, Singapore
Chee Ping LEE, TC Member Lam Research, Singapore
Rathin MANDAL, TC Member Institute of Microelectronics, Singapore
Haruchi KANAYA, TC Member Kyushu University, Japan
Dongshun BAI, TC Member Brewer Science, Singapore
Tingyu Leon LIN, TC Member Guangdong Fozhixin Microelectronics Research, China
Quality, Reliability & Failure Analysis
Alfred YEO, TC Chair Advanced Micro Devices, Singapore
Ming XUE, TC Co-Chair Infineon Technologies, Singapore
Christian BIRZER, TC Member Infineon Technologies, Germany
Xuejun FAN, TC Member Lamar University, USA
Keith NEWMAN, TC Member Advanced Micro Devices, Singapore
Hong Wan NG, TC Member Micron Semiconductor, Singapore
Shaw Fong WONG, TC Member Intel, Malaysia
Chin Hui CHONG, TC Member Micron Technology, Singapore
Lei Jun TANG, TC Member Institute of Microelectronics, Singapore
Ai Kiar ANG, TC Member IBM, Singapore
Haohui LONG, TC Member Huawei Technologies., China
Stevan G HUNTER, TC Member Arizona State University, USA
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Interconnection Technologies
Prof Tan Chuan Seng, TC Chair Nanyang Technological University, Singapore
Lois Liao, TC Co-Chair Wintech Nano-Technology Services, Singapore
Horst CLAUBERG, TC Member Kulicke &
Soffa, USA
Wei FAN, TC Member Singapore Institute of Manufacturing
Technology, Singapore
Nga Phuong PHAM, TC Member IMEC, Belgium
Daquan YU, TC Member Chinese Academy of Science, China
David HUTT, TC Member Loughborough University, UK
Jack XIONG, TC Member Qorvo, Singapore
Tanemasa ASANO, TC Member Kyushu University, Japan
Lam WAI, TC Member Nexperia
Liming SHEN, TC Member Kulicke & Soffa, Singapore
Lam WAI, TC Member Nexperia, Hong Kong
Serguei STOUKATCH, TC Member Liege University, Belgium
Electrical Simulations & Characterization
Mihai ROTARU, TC Chair Institute of Microelectronics, Singapore
Bruce KIM, TC Co-Chair City University of New York, USA
Aoyagi MASAHIRO, TC Member AIST, Japan
Weerasekera ROSHAN, TC Member University of the West of England, UK
Arif ENGIN, TC Member San Diego State University, USA
Fujiang LIN, TC Member USTC, China
Jianyong XIE,
TC Member Intel, USA
Chetan VERMA, TC
Member NXP Semiconductors, India
Fei GOU, TC Member Advanced Micro Devices, Canada
Jackson KONG, TC Member Intel, Malaysia
Sungho KANG, TC Member Yonsei University, South Korea
En-Xiao LIU, TC Member Institute of High Performance Computing, Singapore
Mechanical Simulation & Characterization
Andrew TAY, TC Chair National University of Singapore, Singapore
Kuo Ning CHIANG, TC Co-Chair National Tsing Hua University, Taiwan
Roseanne DUCA, TC Member STMicroelectronics
Sasi Kumar TIPPABHAOTLA,
TC Member A*STAR IME, Singapore
Wei ZHOU, TC Member Micron Technology, Singapore
Richard RAO, TC Member Marvell Technology, USA
Xiaowu ZHANG, TC Member Institute of Microelectronics, Singapore
Christopher BAILEY, TC Member University of Greenwich, UK
Rathin MANDAL, TC Member Institute of Microelectronics, Singapore
Yong LIU, TC Member ON Semiconductor, USA
Jeff SUHLING, TC Member University of Auburn, USA
Rainer DUDEK, TC Member Fraunhofer ENAS, Germany
Ah-Young PARK, TC Member Korea Institute of Machinery and Materials, South
Korea
Qiang YU, TC Member Yokohama National University, Japan
SB Park, TC Member Binghamton University, USA
Advanced Optoelectronics and Displays
Haohui LONG , TC Chair Huawei Technologies, China Wenhui ZHU, TC Co-Chair Central South University, China
Jianhua ZHANG, TC Member
Shanghai University, China
Xueren ZHANG, TC Member
Xilinx, Singapore
Zhang LI, TC Member Huawei Technologies, China Zheng GONG, TC Member Guangdong Institute of Semiconductor Industrial Technology,
China
Nagendra Sekhar VASARLA, TC Member Institute of Microelectronics, Singapore
Horst CLAUBERG, TC
Member Kulicke &
Soffa, USA
Wolfgang REINERT, TC Member Fraunhofer Institute for Silicon Technology,
Germany
Liancheng WANG, TC Member Central South University, China
Zi-Hui ZHANG, TC Member Hebei University of Technology, China
Xiaoyan YI, TC Member Institute of Semiconductor, China
Anlian PAN, TC Member Hunan University, China
Sung-Min LEE, TC Member Kookmin University, South Korea
Yang ZHOU, TC Member Wuhan University, China
Xuan CAO, TC Member Chengdu Vistar Optoelectronics, China |
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Chun Hong KANG, TC Member KAUST, Saudi Arabia |
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Emerging Technologies
Kripesh
VAIDYANATHAN, TC Chair Institute of Technical
Education, Singapore
Martin OPPERMANN, TC Co-Chair Dresden University of Technology,
Germany
Perceval COUDRAIN, TC Member CEA-LETI, France
Toni MATTILA, TC Member Aalto University Espoo, Finland
Nga Phuong PHAM. TC Member IMEC, Belgium
Wolfgang REINERT, TC Member Fraunhofer Institute for Silicon
Technology, Germany
Thomas ZERNA, TC Member Dresden University of Technology, Germany
Yufeng YAO, TC Member Broadcom, Singapore
Rama Krishna KOTLANKA, TC Member Analog Devices, USA
Piotr Mackowiak Fraunhofer IZM Materials and Processing
Chin Hock TOH, TC Chair Packaging Professional, Singapore Alvin LEE, TC Co-Chair Brewer Science, Taiwan
Chee Lip GAN, TC Member Nanyang Technological University,
Singapore
Sungdong KIM, TC Member Seoul National University of Science
& Technology, South Korea
Kim Shyong SIOW, TC Member Universiti Kebangsaan Malaysia, Malaysia
Changqing LIU, TC Member Loughborough University, UK
Vempati Srinivasa RAO, TC Member Institute of Microelectronics, Singapore
Suan Hui PU, TC Member University of Southampton, Malaysia
Yu-Po WANG, TC Member Siliconware Precision Industries,
Taiwan
SS KANG, TC Member Heraeus, Singapore
An XIAO, TC Member Ampleon, Netherlands
Lewis HUANG, TC Member Senju Metal Industry, Taiwan
Santosh Kumar RATH, TC Member Applied Materials, Singapore
Albert LAN, TC Member Applied Materials, Taiwan Po Hao TSAI, TC Member DuPont, Taiwan
Eric Phua, TC Member Nanofilm Technologies Intl Ltd, Singapore Lan PENG, TC Member IMEC, Belgium Hemanth Kumar CHEEMALAMARRI, TC Member IME, A*STAR, Singapore Thermal Management and
Characterization
Rathin MANDAL, TC Chair Institute of Microelectronics, Singapore
Marta RENCZ, TC Co-Chair Mentor Graphics - MicReD, Hungary
Yogendra JOSHI, TC Member Georgia Institute of Technology, USA
Justin A. WEIBEL, TC Member Purdue University, USA
Hengyun ZHANG, TC Member Shanghai University of Engineering
Science, China
Marcin JANICKI, TC Member Lodz University of Technology, Poland
Yong HAN, TC Member Institute of Microelectronics, Singapore
Kazuyoshi FUSHINOBU, TC Member Tokyo Institute of Technology, Japan
Ye HONG, TC Member University of Science and Technology,
China
Codecasa LORENZO, TC Member Politecnico di Milano, Italy
Pengfei LI, TC Member Huawei Technologies, China
Shankar S, TC Member Shiretechnik Solutions, India
Yan XU, TC Member Huawei Technologies, China
Shreyas BINDIGANAVALE, TC Member Advanced Micro Devices, Singapore
Gamal REFAI-AHMED, TC Member Xilinx, USA
Andy WANG, TC Member Xilinx, USA
Tiwei WEI, TC
Member Stanford University, USA
Smart Manufacturing & Equipment
Technology
Chandra BHESETTI, TC Chair Institute of Microelectronics, Singapore Eric Phua, TC Co-Chair Nanofilm Technologies Intl Ltd, Singapore
Arthur WEE, TC Member Infineon Technologies, Singapore
Wint PHYU, TC
Member Kulicke &
Soffa, Singapore
Ai Kiar ANG, TC
Member IBM, Singapore
Tick Kwang LOH, TC
Member Kulicke &
Soffa, Singapore
Leon Tingyu LIN, TC Member Guangdong Fozhixin Microelectronics, China |