PDC courses
PDC |
Title |
Instructor |
1 |
Fan-Out,
Chiplet, and Heterogeneous Integration Packaging |
John H
Lau (Biography) |
Unimicron
Technology Corporation, Taiwan |
||
2 |
Flip
Chip Interconnects |
Eric
Perfecto (Biography) |
IBM
Research, USA |
||
3 |
Co-Packaged
Si Photonics: Opportunities and Challenges |
Amr S
Helmy (Biography) |
University
of Toronto, Canada |
||
4 |
Design-on-Simulation
Technology for Advanced Packaging Reliability Life Prediction |
Kuo-Ning
Chiang (Biography) |
National
Tsing Hua University, Taiwan |
||
5 |
Automotive
Electronics Reliability – Challenges and Opportunities |
Pradeep
Lall (Biography) |
Auburn
University, USA |