Professional Development Courses:

1. Chiplet, Heterogeneous Integration, and Co-Packaged Optics, John H Lau, Unimicron Technology Corporation, Taiwan.

2. Photonic Technologies for Communication, Sensing, and Displays, Torsten Wipiejewski, Huawei.

3. Wafer Bonding for Advanced Packaging Applications, Viorel DRAGOI, EVG.

4. Current and Future Challenges and Solutions in AI & HPC System and Thermal Management, Refai-Ahmed Gamal, AMD.

5. Mechanics and Reliability of Lead-Free Solder Joints, Jeff Suhling, Auburn University.

6. Failure Analysis of Advanced Packages: Fundamental, Skills, Philosophy and Case studies, Yong-Fen Hsieh, MA-Tek

For details, click here : PDC