PDC

Title

Instructor

1

Fan-Out, Chiplet, and Heterogeneous Integration Packaging

John H Lau  (Biography)

Unimicron Technology Corporation, Taiwan

2

Flip Chip Interconnects

Eric Perfecto (Biography)

IBM Research, USA

3

Co-Packaged Si Photonics: Opportunities and Challenges

Amr S Helmy (Biography)

University of Toronto, Canada

4

Design-on-Simulation Technology for Advanced Packaging Reliability Life Prediction

Kuo-Ning Chiang (Biography)

National Tsing Hua University, Taiwan

5

Automotive Electronics Reliability – Challenges and Opportunities

Pradeep Lall (Biography)

 Auburn University, USA