Professional Development Courses

Title:  Fan-out, Chiplets and Hybrid Bonding

Instructor: John H Lau, Unimicron Technology Corporation

Biography John H Lau with more than 40 years of R&D and manufacturing experience in semiconductor packaging, John has published more than 500 peer-reviewed papers, 30 issued and pending US patents, and 22 textbooks on, e.g., Advanced MEMS Packaging (McGraw-Hill, 2010), Reliability of 2D and 3D IC Interconnects (McGraw-Hill, 2011), TSV for 3D Integration, (McGraw-Hill, 2013), 3D IC Integration and Packaging (McGraw-Hill, 2016), Fan-out Wafer-Level Packaging (Springer, 2018), Heterogeneous Integrations (Springer, 2019), Assembly and Reliability of Lead-Free Solder Joints (Springer, 2020), and Semiconductor Advanced Packaging (Springer, 2021). John is an elected ASME Fellow, IEEE Fellow, and IMAPS Fellow.    


Abstract: Fan-out packaging has been getting lots of tractions since TSMC used their integrated fan-out (InFO) to package the application processor for the iPhone in 2016. The fundamental, recent advances and trends of fan-out packaging will be presented. Chiplets have been very popular since DARPA’s CHIPS (common heterogeneous integration and IP reuse strategies) program initiated in 2017. Microprocessors such as AMD’s EPYZ and Intel’s Lakefield have been in high volume manufacturing with chiplet designs and heterogeneous integration packaging. The state-of-the-art and outlook of chiplets will be provided. Hybrid bonding has been getting lots of attention since Sony extended their license of “Zibond” to include Ziptronic’s DBI (direct bond interconnect) in 2015 and used for manufacturing the CMOS image sensors and other image-based devices in 2016. The fundamental, recent advances and trends of hybrid bonding will be presented.

John H Lau  



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