Invited Speakers

Dr. Werner Kanert (Click for Biography)
Infineon Technologies AG, Munich, Germany
Invited Speaker Presentation
Assessment of Package Reliability for Harsh Environments

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Dr. Eiji Higurashi (Click for Biography)
University of Tokyo
Invited Speaker Presentation
Low-temperature packaging technologies for optical microsystems.

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Dr. Andreas Knoblauch (Click for Biography)
Infineon BE R&D
Invited Speaker Presentation
Virtual Prototyping for package development - benefits and limitations

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Dr. Yasuhiro Morikawa (Click for Biography)
ULVAC, Inc. Institute of Semiconductor and Electronics Technologies
Invited Speaker Presentation
High-density packaging technology solution for Cyber-Physical System (CPS) society

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Mr. Damo Srinivas (Click for Biography)
Lam Research
Invited Speaker Presentation
Next Generation TSV Challenges and Solutions

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Dr. YOON Seung Wook (Click for Biography)
STATS ChipPAC Ltd.
Invited Speaker Presentation
Growth of the FO-WLP Applications : Present and Future

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Mr. Santosh Kumar (Click for Biography)
Yole Development
Invited Speaker Presentation
Flip chip packaging: Technology and Market trends

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Dr. Noriyuki Fujimori (Click for Biography)
Olympus Corporation, Japan
Invited Speaker Presentation
Wafer Level Chip Size Package by using Post Dicing Process and its Application to the CMOS Image Sensor Module for Medical Device

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Steffen Kröehnert (Click for Biography)
NANIUM S.A., Director of Technology
Invited Speaker Presentation
High Density Package Integration for Wearables and IoT Applications by eWLB based WLSiP and WLPoP

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LC Tan (Click for Biography)
Director of Freescale
Invited Speaker Presentation
Innovation and entrepreneurship in competitive packaging solution offering

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Tonny Kamphuis (Click for Biography)
NXP Semiconductors Nijmegen
Invited Speaker Presentation
Advanced protected WLCSP

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Premachandran (Click for Biography)
Globalfoundries, Malta, NY
Invited Speaker Presentation
Reliability needs for Via Middle TSV for 3DIC packaging -a foundry prespective

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Jensen Tsai (Click for Biography)
Deputy Director of Customer Advanced Product Division of SPIL (Siliconware, Taiwan)
Invited Speaker Presentation
Innovative Technology Perspective : Wafer Level Package and Integration

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