Speaker’s Biography

Dr. Mo Shakouri is co-founder, President & CEO of Microsanj LLC, a leading supplier of high resolution, thermal imaging systems designed to address the thermal challenges faced by today’s advanced device designers.  Dr. Shakouri received his PhD from Stanford University and has more than 20 years of experience directing major programs with Hewlett-Packard Corporation, Lucent Technologies, and Alvarion Corporation prior to the founding of Microsanj in 2007. Mo also serves as CEO for Telewave.io which designs and manufactures high quality products for RF networks. Telewave.io strives to be the premier supplier of seamless interoperable communication systems that provide security and reliability in mission critical eco-systems for both commercial and military applications worldwide. Mo is also the Board Chairman for the WiMAX Forum which is an industry trade organization formed by leading communications, component, and equipment companies to promote and certify compatibility and interoperability of broadband wireless access equipment that conforms to the IEEE 802.16 and ETSI HIPERMAN standards.

Abstract

Demands for miniaturization, whether driven by the need for portability or the need to integrate more functionality into a small form factor, is leading to higher levels of integration. Although there are many advantages of 2.5D and 3D packaging structures, there are also many challenges arising for their testing and analysis. These advanced performance-driven designs create further challenges for packaging, testing, and thermal management. One of the challenges is the feature size and operating speed of these devices which are now sub-micron, where traditional methods of thermal analysis such as infrared thermography are no longer adequate. Some failures are embedded inside 3D structures, and it is a challenge to establish their location within the structures. For advanced microwave systems such as Antennae-in-Package (AiP), beam-steering and beamforming antennas, characterization of their electromagnetic fields is a challenge due to the partial and spatial coherence of the resulting fields. This presentation will describe the above-mentioned challenges and techniques available to meet these challenges including thermal characterization of sub-micron microelectronic and photonic devices, electromagnetic field characterization of advanced microwave systems, and failure analysis of heterogeneously integrated devices.