Packaging Education Workshop
Date/Time: Dec 8, 1:10pm
- 2:25pm
Venue: Veranda III
Chairs: Prof Jeff
Suhling and Prof Andrew Tay
Objective:
Electronics packaging is a wide-ranging,
multi-disciplinary field. This is evidenced by the following list of Technical
Committees associated with the Electronics Packaging Society: Materials &
Processes; High Density Substrates & Boards; Electrical Design, Modeling
& Simulation; Thermal & Mechanical; Emerging Technology;
Nanotechnology; Power & Energy; RF & Thz Technologies; Photonics;
3D/TSV; Reliability; Test. With such a wide-ranging field, universities all
over the world are facing a real challenge in designing an education program to
prepare their graduates for this industry. Indeed, many universities don’t even
try and simply stick to imparting the fundamentals of science and engineering
to their students, leaving companies to provide further specialized training
after they are employed by the companies. On the other hand, many companies
would like universities to at least teach some specialization modules in
electronics packaging. The main objective of this Workshop is to discover what
some universities in Asia are doing in preparing their students to enter this
industry. Much of electronics packaging is carried out in Asia. Are there any
specialization programs on electronics packaging in Asian universities? What is
the rationale behind them? How different are they from those in America and
Europe?
Agenda
1:10-1:15 – Welcome and Introduction: Prof Andrew Tay, National University of Singapore.
1:15-1:25 – Prof K. N. Chiang, National Tsing Hua University, Taiwan. (Virtual)
1:25-1:35 – Prof Wenhui Zhu, Central South University, China.
1:35-1:45 – Prof Gu-Sung Kim, Kangnam University, South Korea.
1:45-1:55 – Prof Anandaroop Bhattacharya, IIT Kharagpur, India.
1:55-2:05 – Prof Chuan Seng Tan, Nanyang Technological University, Singapore
2:05-2:25 – Q&A and Wrap Up: Prof Jeff Suhling, Auburn University, USA
Biographies of Speakers:
Dr K. N. Chiang received his Ph.D. degree from the Georgia Institute of Technology, USA. Currently, he is the Chair Professor of the National Tsing Hua University in Hsinchu, Taiwan. From 2010 to 2013, he served as Director of the National High-Performance Computing Center, the National Strategic Research Center of Taiwan. He has received three outstanding research awards from the Ministry of Science and Technology of Taiwan and has published more than 400 technical papers in international journals and conference proceedings. He has obtained more than 50 EP-related patents. Currently, he is Editor-in-Chief of the Journal of Mechanics (SCI), Senior Area Editor of the IEEE Transactions on Component, Packaging and Manufacturing Technology (SCI), and academic editor of Materials (SCI). Professor Chiang is an IEEE / ASME / STAM Fellow and the Academician of the International Academy of Engineering.
Dr Wenhui Zhu is a
professor at Central South University, China, and Founder & Chairman of
Changsha AMQ Intelligent Technology Pte Ltd. He was elected as a National Elite
Talent of China and a Full member of the Russian Academy of Natural Sciences. Previously
he was Chief Technology Officer of Tian Shui Hua Tian Technology Co. Ltd, CEO
of Kun Shan Q Technology Limited Co. He was Chief Scientist of the 973 program
on IC wafer level 3D integration, and has been working in TSV packaging, DFR
(design for reliability), DFM (design for manufacturability) and DFP (design
for performance), packaging materials and 3D nano-/micro-electronics packaging
in leading semiconductor and packaging companies including Infineon and UTAC.
Dr. Zhu chaired many key projects in advanced packaging and structural
integration such as the national 863 project and state key technology projects
and made great achievements in technology innovation and cost-saving. He has
been invited to give keynote talks and short courses in international forums
and conferences. Dr. Zhu has published more than 230 technical papers and won 8
times of best paper awards.
Dr Gu-Sung Kim (M: 2018, SM: 2016) is
currently a professor at Kangnam University and a founder of EPRC (Electronic
Package Research Center) and EPMS (Electronic-Package Mission
Society). He has 30 years of experience in R&D of Semiconductor
Packaging. Prior to joining and establishing his lecture/research position, Kim
was a 3D IC/TSV/WLP project leader at Samsung Electronics Co., Ltd, IPT team,
Memory Division for 17 years. He has more 130 patents as an inventor in Korea
and USA related to 3D IC, TSV, and Interposer. He has published 2 semiconductor
packaging handbooks and taught more than 3000 engineers in Korea. He has received
several awards from Korea MOTIE government, Samsung, Alfred Marquis Lifetime,
City May, and SEMI etc. Kim received a Ph.D. degree in materials
engineering from Rensselaer Polytechnic Institute, Troy, NY, USA, and a BS
degree in ceramic engineering from Yonsei University, Seoul, Korea. He has
served as chair of IEEE EPS Korea Council, SEMI STS ESIP, several National
R&D programs, vice-chair of KSDT, deputy-chair of EPRC, Kangnam University
and Packaging Technology WG at KMEPS. He also has a position of BOD Chair of
Electro-Package Mission Society (EPCross).
Dr Anandaroop Bhattacharya is an
Associate Professor of Mechanical Engineering and former Associate Dean,
International Relations & Ranking at IIT Kharagpur. His research interests
lie in the areas of electronic thermal management, transport in porous media,
thermal management of Li-ion batteries and microfluidics. Anandaroop received
his B. Tech. from IIT Kharagpur in 1997 and his M.S. and Ph.D. degrees from
University of Colorado at Boulder, USA in 1999 and 2001 respectively. Prior to
joining IIT Kharagpur in 2015, he spent 12 years in the industry working in
various researcher and technology leadership roles at Intel, General Motors and
GE Global Research. He has 26 patent filings (17 US and 9 Indian), 2 book
chapters, and over 70 international journal and conference publications to his
credit. He serves as an Associate Editor of IEEE Transactions on Components
Packaging and Manufacturing Technologies (IEEE TCPMT) and ASME Journal of
Thermal Science and Engineering Applications (ASME TSEA). Anandaroop has
received several awards in his career so far including the INAE Young Engineer
Award (2009), Faculty Excellence Award from IIT Kharagpur (2021),
Fulbright-Nehru IEAS Fellowship (2020), Shastri Indo-Canadian Institute
Fellowship (2020), GE Organizational Citizen Award (2015) and Intel MPG
Achievement Award (2009). At IIT Kharagpur, he is presently involved in several
sponsored research projects with funding from DST, Intel Corporation, General
Electric, Mathworks, Tata Motors and ISRO. He is also the joint PI for Indian
Government's National Mission project on Virtual Labs at IIT Kharagpur.
Dr Chuan Seng Tan (S’01-M’06-SM’19) is a Professor of
Electronic Engineering at the School of Electrical and Electronic Engineering
at Nanyang Technological University, Singapore. He received his PhD from MIT in
2006. Currently, he is working on process technology of three-dimensional
integrated circuits (3D IC), as well as engineered substrate (Si/Ge/Sn) for
group-IV photonics. He has numerous publications (journal and conference) and
IPs on 3D technology and engineered substrates. Nine of his inventions have
since been licensed to a spin-off company. He co-edited/co-authored five books
on 3D packaging technology. He is a senior member of IEEE and a recipient of
the Exceptional Technical Achievement Award from the IEEE Electronics Packaging
Society (EPS) in 2019. Beginning June 2019, he is a Distinguished Lecturer with
IEEE-EPS. He is a Fellow of the International Microelectronics Assembly and
Packaging Society (IMAPS) since 2019 and a recipient of the William D. Ashman -
John A. Wagnon Technical Achievement Award in 2020. He was the Chair of the
Interconnections Sub-Committee for ECTC’2021. He was the General Chair of the
2020 IEEE Electronics Packaging Technology Conference (Virtual). In addition,
he is an Associate Editor for the IEEE Transactions on Components, Packaging and
Manufacturing Technology and was recognized with the Best Associate Editor
Award in 2021.
Dr K. N. Chiang
Dr Wenhui Zhu
Dr Gu-Sung Kim
Dr Anandaroop Bhattacharya
Dr Chuan Seng Tan