HIR Workshop

Heterogeneous Integration Paving the Way for Global Electronics Resurgence

Abstract: Heterogeneous Integration through advanced packaging innovations is widely acknowledged as being increasingly important to drive performance, system availability, power efficiency, cost and time to market of microelectronics systems, from HPC & Data Centers, to 5G & beyond, mobile, autonomous automotive, IoT, medical and health markets. The Heterogeneous Integration Roadmap is a system and application driven roadmap inclusive of the full microelectronics technology ecosystem with the purpose to deliver the next extension of Moore’s law for decades to come. 

Date: December 9, 2022

14:35-14:45  Welcome & Introduction – Prof. Andrew Tay, NUS

14:45-15:05  HIR Overview – Dr. Ravi Mahajan, Intel 

15:05-15:25  Supply Chain - Dr. Kitty Pearsall, IEEE EPS President

15:25-15:55  Break

15:55-16:15  Thermal Management - Dr. Gamal Refai-Ahmed, AMD    

16:15-16:35   2D - 3D & Interconnect – Dr. Ravi Mahajan, Intel    

16:35-16:55   Photonics – Prof. Amr Helmy, U of Toronto    

16:55-17:05  Wrap-Up – Dr. Ravi Mahajan

Biographies of Speakers:

Dr Ravi Mahajan is an Intel Fellow responsible for Assembly and Packaging Technology Pathfinding for future silicon nodes. Ravi also represents Intel in academia through research advisory boards, conference leadership and participation in various student initiatives. He has led Pathfinding efforts to define Package Architectures, Technologies and Assembly Processes for multiple Intel silicon nodes, including 90nm, 65nm, 45nm, 32nm, 22nm and 7nm silicon. Ravi joined Intel in 1992 after earning his Ph.D. in Mechanical Engineering from Lehigh University. He holds the original patents for silicon bridges that became the foundation for ' 'Intel's EMIB technology. His early insights have led to high-performance, cost-effective cooling solutions for high-end microprocessors and the proliferation of photo-mechanics techniques for thermo-mechanical stress model validation. His contributions during his Intel career have earned him numerous industry honors, including the ' 'SRC's 2015 Mahboob Khan Outstanding Industry Liaison Award, the 2016 THERMI Award from SEMITHERM, the 2016 Allan Kraus Thermal Management Medal & the 2018 InterPACK Achievement award from ASME, the 2019 ”Outstanding Service and Leadership to the IEEE” Awards from IEEE Phoenix Section & Region 6 and most recently the 2020 Richard Chu ITherm Award and the 2020 ASME EPPD Excellence in Mechanics Award. He is one of the founding editors for the Intel Assembly and Test Technology Journal (IATTJ) and is currently VP of Publications & Managing Editor-in-Chief of the IEEE Transactions of the CPMT. He has long been associated with ' 'ASME's InterPACK conference and was Conference Co-Chair of the 2017 Conference. Ravi is a Fellow of two leading societies, ASME and IEEE.  He was elected to the National Academy of Engineering in 2022 for contributions to advanced microelectronics packaging architectures and their thermal management.

Dr Kitty Pearsall received the BS degree in Metallurgical Engineering (1971) from the UT El Paso. Kitty received the MS and Ph.D. degree in Mechanical Engineering and Materials from the UT Austin in 1979 and 1983 respectively. Kitty worked for IBM from 1972 to 2013. In 2005 Kitty was appointed an IBM Distinguished Engineer and was elected to the IBM Academy of Technology. Kitty was a process consultant and subject matter expert working on strategic initiatives impacting component qualification and end quality of procured commodities. She engaged with worldwide teams implementing cross-brand, cross commodity processes/products that delivered high quality/high reliability end product. Kitty received 4 IBM Outstanding Technical Achievement Awards; holds 9 US patents; 2 patents pending; and 8 published disclosures. She has numerous internal publications as well as 22 external publications in her field. Kitty is a licensed Professional Engineer (Texas since 1993). Kitty was the recipient of the UT Austin - Cockrell Engineering Distinguished Engineering Graduate Award in 2007 followed by induction into the UT Mechanical Engineering Dept. Academy of Distinguished Alumni in 2008. Kitty was awarded the Women in Technology Fran E. Allan Mentoring Award (2006) in recognition of her people development both in and outside of IBM. Currently Kitty is President of Boss Precision Inc. and works as an Independent consultant. This has included a one year engagement with Shainin Corporation.

Dr. Gamal Refai-Ahmed, Life Fellow ASME, Fellow IEEE, Fellow Canadian Academy of Engineering, Professional Engineer Ontario, EPS IEEE Distinguished Lecture, is AMD Senior Fellow.  He obtained the Ph. D. degree from the University of Waterloo. He has been recognized as one of the global technical leaders through his numerous publications (more than 120 publications) and patents& patents pending US (more than 65) and International (more than 110). His contributions are clearly seen in several generations of both GPU, CPU and FPGA for HPC, AI, ML, NIC, Game Console, Aerospace& Defense and Telecom products. In 2015, Gamal was tasked to  initiate the heterogeneous integration of system level power, thermal, mech and assembly with package and Si development in first initial planning.  He has been a key player to introduce all Alveo products and high-end Si  CoWos, InFo, Chiplets  PKG  to AMD Customers. He was behind the introduction of the first Lidless FPGA   20, 16, 7nm technology nodes with highest warpage in mass production in  Alveo products, and its Telecom, AI, HPC customers (e.g. MSFT, AWS, Nokia, Cisco and A&D).  his developed strategy of technology enable AMD FPGA products to outperform the Intel/Altera Products. Gamal is the recipient of 2008 excellent thermal management award, 2010 Calvin Lecture and 2013 K16- Clock award in recognition for his scientific contributions and leadership of promoting best electronics packaging engineering practice. In 2014, Gamal received the IEEE Canada R. H. Tanner Industry Leadership for sustained leadership in product development and industrial innovation. In 2016, ASME awarded Gamal the ASME Service Award. State University of New York, Binghamton University awarded him the Innovation Partner Award for his industrial role with Binghamton University. In continuation to Dr Refai contributions to the best engineering practice, State University of New York at Binghamton awarded him the Presidential University medal in 2019 which is the highest recognition honor by the university.  In 2021, Gamal was elected to IEEE Fellow and  EIC Fellow.

Dr Amr S. Helmy is a professor in the department of electrical and computer engineering at the University of Toronto. Prior to his academic career, Amr held a position at Agilent Technologies - UK, between 2000 and 2004.  At Agilent his responsibilities included developing lasers and monolithically integrated optoelectronic circuits. He received his Ph.D. and M.Sc. from the University of Glasgow with a focus on photonic fabrication technologies, in 1999 and 1994 respectively.  He received his B.Sc. from Cairo University in 1993, in electronics and telecommunications engineering science. His research interests include photonic device physics and characterization techniques, with emphasis on plasmonics, nonlinear and quantum photonics

Dr. Ravi Mahajan

Dr. Kitty Pearsall