Call for Papers
The 22nd
Electronics Packaging Technology Conference (EPTC 2020) is an international
event organized by the IEEE RS/EPS/EDS Singapore Chapter and co-sponsored by
IEEE Electronics Packaging Society (EPS). EPTC 2020 will feature keynotes,
technical sessions, short courses, forums, an exhibition, social and networking
activities. It aims to provide a good coverage of technology developments in
all areas of electronics packaging from design to manufacturing and operation.
It is a major forum for the exchange of knowledge and provides opportunities to
network and meet with leading international experts. Since
its inauguration in 1997, EPTC has developed into a highly reputed electronics
packaging conference in the Asia Pacific and is well attended by experts in all
aspects of packaging technology from all over the world. EPTC is the flagship conference of IEEE EPS in Region 10.0.
You are invited to submit abstract(s), presenting new developments in the following categories:
Advanced Packaging: Advanced Flip-chip, 2.5D & 3D, embedded passives & actives on substrates, System in Packaging, Embedded chip packaging technologies, Panel level packaging, RF, Microwave & Millimeter-wave, Power and Rugged Electronics Packaging, etc.
TSV/Wafer Level Packaging: Wafer level packaging (Fan in/Fan out), Embedded chip packaging, 2.5D/3D integration, TSV, Silicon & Glass interposer, CoWoS, FoCoS, InFo, eWLB, Bumping technologies, etc.
Interconnection Technologies: Au/Ag/Cu/Al Wire-bond / Wedge bond technology, Flip-chip & Cu pillar, Solder alternatives, Cu to Cu, Wafer level bonding & die attachment (Pb-free), etc.
Emerging Technologies: Packaging technologies for MEMS, biomedical, Optoelectronics, Internet of things, Photovoltaic, Printed electronics, Wearable electronics, Photonics, LED, etc.
Materials and Processing: Advanced materials (such photoresist, polymer dielectrics, solder, die attach, underfill), Substrates, Lead-frames, PCB for advanced packaging, Assembly processes using advanced materials, etc.
Assembly and Manufacturing Technology: Assembly equipment automation and improvements. Embedded/Hybrid Package Manufacturing Processes. Warpage Control and Management in Board Level Assembly, Thin Die/Package Handling and Assembly. Large/Ultra Large Package (SiP, SIM, MCP) Integration and Processing. Panel Level Manufacturing. Smart Manufacturing technology. Data analytics. Advanced metrology. Machine learning.
Advanced Materials and Process Manufacturing Technology: Processing characterization of advanced materials, Substrates, Lead-frames, etc. Advanced equipment for assembly process and handling. Large/Ultra Large Package (SiP, SIM, MCP) Integration and Processing. Panel Level Manufacturing.
Electrical Simulation & Characterization: Power plane modeling, Signal integrity analysis by simulations and characterization, 2D/2.5D/3D package level high-speed signal design, Characterization and test methodologies.
Mechanical Simulation & Characterization: Thermal-mechanical interaction study, Moisture, Fracture, Fatigue, dynamic impact modeling and characterization. Process modeling, etc.
Thermal Characterization & Cooling Solutions: Thermal characterization and simulation, Component, system and product level thermal management and characterization
Quality, Reliability & Failure Analysis: Silicon, component, board and system level reliability assessment, Interfacial adhesion, Accelerated testing, Failure characterization, etc.
Special Sessions: Please submit your proposals to the General Chair and Technical Chair.
