EPTC 2016 Professional Development Course

JamesMorris
Course Leader: James E. Morris
Title : Nanotechnologies for Microelectronics Packaging Applications:
Current trends in IoT, Wearable, 3D, Flex Circuits, Thermal and Embedded passives
Affiliation: James E. Morris, Portland State University, USA
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IngridDeWolf

Course Leader: Ingrid De Wolf, Prof.
Title : 3D Integrated Circuits Failure Analysis
Affiliation: IMEC, Belgium & KULeuven, Belgium
Course description:

 

 

 

 


Course Leader: Albert Lan
Title : Fan-In and Fan-Out in Wafer Level Packaging
Affiliation: SPIL, Taiwan
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Course Leader: Yogendra Joshi
Title : Energy Efficient Thermal Management of Data Centers
Affiliation: Georgia Tech, USA
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Course Leader: Holden Li
Title : Internet of Things (IoT) focusing on Wireless Sensors Network and Active RFID
Affiliation: Tamasek Laboratories at Nanyang Technological University, Singapore
Course description:

 

 

 

 


Course Leader: Paul D. Franzon
Title : 2.5D- and 3D-Stacked Integrated Circuits
Affiliation: North Carolina State University, USA
Course description:

 

 

 

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EPTC 2016: Speaker Update, Dr Rejeki Simanjorang will talk about Advance Packaging Requirement for Power Semiconductor Module

Dr Rejeki Simanjorang will talk about: Requirement for Advanced-Packaging Technology of Power Semiconductor Module in High Power Density Converter for More Electric Transportation. His presentation will elaborate the electrical performances of power module required for high speed switching in high power density converter. Parasitic impedance in power module that originates from devices and packaging layout will be discussed. Their effects to the power converters such as overshoot voltage, EMI issues, and switching loss will be elaborated. Finally, advanced packaging technique to minimize these parasitic impedances will be presented. More detail description can be found here