2018 - Call for Papers and Important Dates
Important Dates Dates
Online abstract submission 30th Mar 2018
Closing of Abstract submission 15th Jun 2018
Notification of acceptance 15th July 2018
Submission of manuscript 15th Sep 2018

CONFERENCE TOPICS

You are invited to submit an abstract, presenting new developments in the following categories:
 
  • Advanced Packaging: Advanced Flip-chip, 2.5D & 3D, PoP, embedded passives & actives on substrates, System in Packaging, embedded chip packaging technologies, Panel level packaging, RF, Microwave & Millimeter-wave, Power and Rugged Electronics Packaging etc.
  • TSV/Wafer Level Packaging: Wafer level packaging (Fan in/Fan out), embedded chip packaging, 2.5D/3D integration, TSV, Silicon & Glass interposer, RDL, bumping technologies, etc.
  • Interconnection Technologies: Au/Ag/Cu/Al Wire-bond / Wedge bond technology, Flip-chip & Cu pillar, solder alternatives (ICP, ACP, ACF, NCP, ICA), Cu to Cu, Wafer level bonding & die attachment (Pb-free) etc.
  • Emerging Technologies: Packaging technologies for MEMS, biomedical, optoelectronics, Internet of things, photo voltaic, printed electronics, wearable electronics, Photonics, LED, etc.
  • Materials and Processing: advanced materials such 3D materials, photoresist, polymer dielectrics, solder materials, die attach, underfill, Substrates, Lead-frames, PCB etc for advanced packaging, and assembly processes using advanced materials
  • Equipment and Process Development & Automation: processes development, equipment automation, process and equipment hardware improvements, data analytics, in-situ metrology.
  • Electrical Simulation & Characterization: Power plane modeling, signal integrity analysis by simulations and characterization. 2D/2.5D/3D package level high-speed signal design, characterization and test methodologies.
  • Mechanical Simulation & Characterization: Thermo-mechanical, moisture, fracture, fatigue, vibration, Shock and drop impact modeling, chip-package interaction, etc.
  • Thermal Characterization & Cooling Solutions: Thermal modeling and simulation, component, system and product level thermal management and characterization
  • Quality, Reliability & Failure Analysis: Component, board, system and product level reliability assessment, Interfacial adhesion, accelerated testing, failure characterization, etc.
     


This year we celebrate 2 decades of EPTC ! On top of being a great packaging conference, this year we bring forth much more! 



Top