The IEEE Electronics Packaging Technology Conference (EPTC) is an annual international event organized by the IEEE RS/EPS/EDS Singapore Chapter and co-sponsored by the IEEE Electronics Packaging Society (EPS). Since its inauguration in 1997, EPTC has been established as a highly reputable international electronics packaging conference and is the IEEE EPS flagship conference in the Asia and Pacific Region. 

Contact us: secretariat@eptc-ieee.net 

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Excited to introduce our distinguished keynote speakers for the 26th IEEE EPTC 2024! Leading voices from industry and academia will address groundbreaking topics:

  • Dr. Calvin Cheung (VP, ASE): Advanced Packaging for AI Performance and Power Effciency
  • Glenn G. Daves (SVP, NXP): Packaging at the emerging edge.
  • Dr. Yu-Po Wang (VP, Siliconware Precision): Breaking boundaries of IC packaging through Innovative Integration Technology.
  • Tim Olson (CEO, Deca): Tectonic Forces shaping the future of the Semiconductor Industry.
  • Dr. Devan Iyer (Chief Strategist, IPC): Advanced Packaging-Customization Trends and Standardization Opportunities.
  • Prof. Subramanian S. lyer (Distinguished Professor and Charles P. Reames Endowed Chair, UCLA): Strategic Directions for Electronics Packaging

General Information

Conference Registration Schedule

View here: Final Program 

Deadlines:

Author Registration: Sept 1, 2024

Early Bird Registration: Oct 31, 2024

Standard Registration: Dec 3, 2024

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EPTC 2023 video click: here

EPTC 2022 video click: here

More information on student travel grants and affiliate memberships can be found under the "Others" tab on this website. 


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