Course Leader: James E. Morris
Title : Nanotechnologies for Microelectronics Packaging Applications:
Current trends in IoT, Wearable, 3D, Flex Circuits, Thermal and Embedded passives
Affiliation: James E. Morris, Portland State University, USA
Course Leader: Ingrid De Wolf, Prof.
Title : 3D Integrated Circuits Failure Analysis
Affiliation: IMEC, Belgium & KULeuven, Belgium
Course Leader: Albert Lan
Title : Fan-In and Fan-Out in Wafer Level Packaging
Affiliation: SPIL, Taiwan
Course Leader: Yogendra Joshi
Title : Energy Efficient Thermal Management of Data Centers
Affiliation: Georgia Tech, USA
Course Leader: Holden Li
Title : Internet of Things (IoT) focusing on Wireless Sensors Network and Active RFID
Affiliation: Tamasek Laboratories at Nanyang Technological University, Singapore
Course Leader: Paul D. Franzon
Title : 2.5D- and 3D-Stacked Integrated Circuits
Affiliation: North Carolina State University, USA
|Online abstract submission start||15th Mar 2016|
|Closing of abstract submission||Extended 24th July 2016|
|Notification of acceptance||15th / 30th July 2016|
|Submission of manuscript||14nd September 2016|
We proudly announce PacTech has taken the Gold Sponsorship for EPTC 2016.
Dr Rejeki Simanjorang will talk about: Requirement for Advanced-Packaging Technology of Power Semiconductor Module in High Power Density Converter for More Electric Transportation. His presentation will elaborate the electrical performances of power module required for high speed switching in high power density converter. Parasitic impedance in power module that originates from devices and packaging layout will be discussed. Their effects to the power converters such as overshoot voltage, EMI issues, and switching loss will be elaborated. Finally, advanced packaging technique to minimize these parasitic impedances will be presented. More detail description can be found here
We proudly announce SPIL has taken the Gold Sponsorship for EPTC 2016.
We proudly announce Kulicke & Soffa has taken the Silver Sponsorship for EPTC 2016.