Electronics Packaging Technology Conference

REGISTRATION IS NOW OPEN

Special rate apply for PDC group registration. Please filled up the group registration form HERE and send it to our conference secretariat HERE

Books Giveaway:

With the support from our Partnering Publisher, we are giving away high quality microelectronics packaging related book to early registrant. The first ten conference registrant or the first registrant for each PDC will be entitle for a book.

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About EPTC

The 18^th Electronics Packaging Technology Conference is an International event organized by the IEEE Reliability/CPMT/ED Singapore Chapter and sponsored by IEEE CPMT Society. EPTC 2016 will feature technical sessions, short courses/ forums, an exhibition, social and networking activities.

PROFESSIONAL DEVELOPMENT COURSES

The conference program includes short courses (30 Nov 2016), which will be conducted by leading experts in the field.

James E. Morris (Portland State University): “Nanotechnologies for Microelectronics PackagingApplications:Current trends in IoT, Wearable, 3D, Flex Circuits, Thermal and Embedded passives”
Ingrid De Wolf (IMEC): “3D Integrated Failure Analysis”
Albert Lan(SPIL): “Fan-In and Fan-Out in Wafer Level Packaging”
Yogendra Joshi(Georgia Tech): “Energy Efficient Thermal Management of Data Centers”
Holden Li(NTU):” Internet of Things (IoT) focusing on Wireless Sensors Network and Active RFID”
Paul D. Franzon(NCSU): “2.5D- and 3D-Stacked Integrated Circuits”

There are special rate fPDC details can be found here

CONFERENCE TOPICS

Advanced Packaging: Flip-chip, multiple array leadframe package, POP, System in Packaging, etc. TSV/Wafer Level Packaging: Fan-in/Fan-out, embedded chip packaging, 2.5D/3D integration, TSV, Silicon & Glass interposer, RDL, bumping technologies, etc.
Interconnection Technologies: Au/Ag/Cu/Al Wire-bond technology, Flip-chip & Cu pillar technology, solder alternatives, Wafer level bonding & die attachment etc.
Emerging Technologies: Packaging technologies for MEMS, biomedical, optoelectronics, Internet of things, photo voltaic, printed electronics, wearable electronics, Photonics, LED, etc.
Materials and Substrates/Leadframes: from polymer to solder materials, and Substrates / Interposer /Leadframes / PCB etc.
Processes and Automation/Equipments: new process as well as equipment automation development.
Electrical Modeling & Simulations: Power plane modeling, signal integrity analysis of substrate/package.
Mechanical Modeling & Simulations: Thermo-mechanical, moisture, fracture, fatigue, vibration, shock and drop modeling, Chip-package interaction, etc.
Thermal Characterization & Cooling Solutions: Component, system and product level thermal management, characterization and simulation
Quality & Reliability: Component, board, system and product level reliability assessment, Interfacial adhesion, accelerated testing, failure characterization, etc.
Wafer/Package level & TSV Testing and Characterization: High-speed test architectures and systems design, 2.5D & 3D test methodologies, probe card design, package-test interaction, high-throughput testing etc.

PANEL TOPIC HIGHLIGHTS

Title: “Rise of China Semiconductor”

Topics: Semiconductor industry statistics and projections in China, Government policies, Supply chain, Semiconductor manufacturing and Packaging technologies, Opportunities & Challenges for China and for other countries/areas

AUTHOR INSTRUCTION

Final Paper Upload:
Please download the EPTC 2016 full paper template from :

https://eptc-ieee.net/resources/

Please check carefully on the guidelines governing paper content, format and conference protocol. Here is the FULL PAPER submission link:

http://itekcms.com/eptc16/paper/ and you can complete and upload the copyright form together with final paper in the same web page.

Registration:
Conference registration, early-bird rates, and information on visas for visiting Singapore can be found at conference website (http://eptc-ieee.net). You or at least one of your co-authors needs to register for the conference in order to be able to present the paper and get the paper published in the IEEE EPTC 2016 proceedings. Registration system is open and here is the link for the same:

https://itekcms.com/eptc16/registration

Early bird registration is till 30 September 2016. Standard registration starts from 1 October 2016.

Hotel :

Hotel booking https://aws.passkey.com/event/16014801/owner/3322522/home

Early Bird Room Rates – By 1st October 2016
Interactive (Poster) PREPARATION GUIDELINES:
Your interactive poster must be prepared and submitted in accordance to the guideline at https://eptc-ieee.net/resources/

Best Papers Awards:
The conference proceeding is an official IEEE publication and accepted paper will be available in IEEE Xplore. Author(s) of Best Industry paper , Best Academia paper, Best Interactive paper and Best Student Paper award sponsored by ASE will receive an award at the next conference EPTC 2017.

Key Dates:
Submission of Final Manuscripts: 15 September 2016
Submission of Electronic Copyright Transfer Form: 15 September 2016
Last Day for Discounted Advance EPTC Registration: 30 September 2016

Conference Registration Date (1^st to 2^nd December 2016)		Advance Registration (Before 30^th Sep 2016)	Standard Registration
IEEE Member	Attendee (Full Conference)	SG$ 800	SG$ 900
IEEE Member	Authors/Speakers (Full Conference)	SG$ 700	SG$ 800
Non-IEEE Member	Attendee (Full Conference)	SG$ 850	SG$ 950
Non-IEEE Member	Authors/Speakers (Full Conference)	SG$ 800	SG$ 900
Student	Attendee or Authors (Full Conference)	SG$ 500	SG$ 600
Professional Development Course (PDC) Date (30^th November 2016) Note: PDC includes Luncheon
IEEE Member	PDC Full (Both AM and PM)		SG$ 425
IEEE Member	PDC Single (AM or PM)		SG$ 275
Non-IEEE Member	PDC Full (Both AM and PM)		SG$ 450
Non-IEEE Member	PDC Single (AM or PM)		SG$ 300
Student	PDC Full (Both AM and PM)		SG$ 275

Ranjan Rajoo, General Chair

Xueren Zhang, Technical Chair

Conference Secretariat eptc16-secretariat@cmsweb.com.sg

https://eptc-ieee.net