HIR Workshop

Heterogeneous Integration Roadmap Workshop

Time : 6:00-7:45pm, December 5, 2019

Venue: Main Hall


Hosts:  Dr William Chen (ASE), Dr Bill Bottoms (3MT Solutions) and Dr Ravi Mahajan (Intel)

Our industry has reinvented itself through multiple disruptive changes in technologies, products, and markets. Our industry continues to change with the rapid migration of logic, memory, and applications to the cloud, the evolution of the Internet of Things (IoT) to the Internet of Everything (IoE), the proliferation of smart devices everywhere, the rise of 5G, the increasing presence of microelectronics in wearables & health application, and  in autonomous automotive, and the rapid advancement of AI .  The pace of innovation is  increasing to meet these challenges. The Heterogeneous Integration Roadmap (HIR) addresses the future directions of heterogeneous integration technologies and applications serving the future markets.


We are celebrating the public release of the 2019 edition of the Heterogeneous Integration Roadmap and initiating preparation for the 2020 Edition of Roadmap 

All conferees are welcome. Registration is not required. 


 Agenda

6:00 pm

Welcome

Dr Andrew Tay (SUTD)

6:05 pm

Opening Remarks

Dr William Chen (ASE) & Dr WR Bottoms (3MTS)

 

 

·Heterogeneous Integration Roadmap Introduction
·Heterogeneous Integration – Driver for Systems of the Future

 

 

 

6:35 pm -

7.45 pm

Panel Session

Moderators: Dr William Chen (ASE) & Dr WR Bottoms (3MTS)

 

 

 

 

Panelists:

Prof Mervi Paulasto-Krockel (Aalto University)

 

 

Dr. Gamal Refai-Ahmed (Xilinx)

 

 

Dr  Loh, Wei-Keat (Intel)

 

 

Prof Christopher Bailey (Greenwich University)


 

Prof Tan, Chuan Seng (Nanyang Technological University)






Dr William Chen 



Dr WR Bottoms






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