Panel Session

Chiplets as enabler for system scaling


Date: December 7, 2022 (Wednesday), 4:0-5:30 PM

Venue: Waterfront Ball Room


Abstract:

Chiplets (or dielets) are gaining traction in the industry as key enabler for future system performance scaling and functional diversification. Unlike monolithic SoC, this technology allows one to mix and match disparate dielets and assemble them using innovative interconnect schemes. It leads to flexible IP reuse, higher yield, shorter time to market and modularity with performance that matches that of SoC. This panel revisits the drivers behind chiplets technology, the manufacturing ecosystem, and use-cases.  The Universal Chiplet Interconnect Express (UCIe) will also be discussed. This panel ends with a critical examination on the supply chain and market outlook.


Moderator: 

Prof. Chuan Seng Tan 



Panelists:

Dr. Ravi Mahajan (Intel),

Dr. Dielacher Bernd (EVG),

Dr. Raj Pendse (Meta),

Dr. Yik Yee Tan (Yole Intelligence)



 


 



  • Platinum Sponsor

  • Gold Sponsor

  • Gold Sponsor

  • Gold Sponsor

  • Gold Sponsor

  • Gold Sponsor

  • Gold Sponsor

  • Gold Sponsor

  • Gold Sponsor

  • Silver Sponsor

  • Silver Sponsor

  • Silver Sponsor

  • Silver Sponsor

  • Silver Sponsor

  • Silver Sponsor

  • Silver Sponsor

  • Silver Sponsor

  • Silver Sponsor

  • Bronze Sponsor

  • Exhibitor

  • Exhibitor

  • Exhibitor

  • Exhibitor

  • Best Student Paper Sponsor

  • Conference Partner

  • Conference Partner

  • Conference Partner

  • Conference Partner

  • Official Media Partner

Top