Panel Session

Panel Session: Packaging material challenges & opportunities for 5G applications

Time : 4:15-6:15pm, December 4, 2019

Venue : Main Hall

 

Moderator

Dr. Haley Fu

Director, Project Management & APAC Operations

iNEMI (International Electronics Manufacturing Initiative)

Dr. Haley Fu is now the Director for project management and Asia Pacific operations of iNEMI. In recent years, she has led consortia programs on low temperature soldering, copper wire bonding, ultra-low loss laminate/PCB, corrosion test development, package warpage characterization, panel level package flowability and warpage, etc.  Prior to iNEMI, Haley worked for Motorola, UTStarcom and Schneider Electric with various R&D and supply chain management positions. Haley received her PhD in mechanical engineering from Shanghai Jiao Tong University in 2000


Panel speakers:


Dr. Toshihisa Nonaka

Technical Director of Packaging Solution Center, Hitachi Chemical Co., Ltd.

He graduated from the University of Tokyo in 1986 and received Ph.D degree in 1995 from Nagoya University.  He has been working in the research of electronic materials more than 30 years. Since he joined Hitachi Chemical in 2015, he has been a technical director of Packaging Solution Center. Current his research topic is process and material development of advance package regarding FO-WLP/PLP, 2.5D, 3D and so on. And he is also leading “JOINT” (Jisso Open Innovation of the Top) consortium which has been founded by Hitachi Chemical in 2018.



Prof. Y. P. Zhang

Professor, School of Electrical and Electronic Engineering at Nanyang Technological University, Singapore

Y. P. ZHANG is a full Professor with the School of Electrical and Electronic Engineering at Nanyang Technological University, Singapore, a Distinguished Lecturer of the IEEE Antennas and Propagation Society (IEEE APS), a Member of the IEEE APS Paper Award Committee. Prof ZHANG was a Member of the IEEE APS Field Award Committee (2015-2017), an Associate Editor of the IEEE Transactions on Antennas and Propagation (2010-2016), and the Chair of the IEEE Singapore MTT/AP joint Chapter (2012), leading the Chapter to win the Best Chapter Awards from the IEEE APS and the IEEE Singapore Section (2013), respectively. Prof ZHANG has published and accepted numerous papers. He received the prestigious IEEE APS Sergei A. Schelkunoff Prize Paper Award (2012). He holds 7 US patents. Prof Zhang was awarded a William Mong Visiting Fellowship by the University of Hong Kong (2005). He was selected by the Recruitment Program of Global Experts of China as a Distinguished Scholar affiliated to Shanghai Jiao Tong University (2012). He has been elevated to the grade of IEEE Fellow for contributions to integrated antennas and subsurface radio since 1 January 2010.



Dr. Shunichi Kikuchi

Corporate Vice President, Fujitsu Advanced Technologies Limited

Mr. Kikuchi joined Fujitsu in 1981. He was engaged in developing liquid cooling modules and multi-chip modules for mainframe servers and supercomputers for 18 years. After that, he was specialized in high density system packaging for notebook PCs and mobile phones for 8 years. Then he has again been in charge of system packaging for high-end servers and supercomputers for 12 years. He has authored and coauthored more than 30 papers and more than 20 U.S. patents. His recent interests are the development of system packaging for high-speed signal integrity and the digital transformation of the system packaging technologies. 



Mr.Erkko Helminen  

Sr. Manager, Advanced Development, TTM Technologies

Mr. Erkko Helminen (M.Sc., EE) is Advanced Development Senior Manager in Advanced Development, Corporate Technology at TTM Technologies, Inc. His key responsibilities are Advanced Development project management, customer projects, process development, SI engineering, and material engineering. He received his diploma M.Sc. from Lappeenranta Univ. of Technology majoring in industrial electronics. He has hold several engineering and development management positions in Aspocomp, Meadville, and TTM. His interests in PCB area are future fabrication processes, smart manufacturing, PCB materials, high speed, and RF PCB technologies, and advanced interconnection technologies.



Dr. Gokul Kumar

Sr. Manager, Packaging Design and Development, Micron

Dr. Gokul Kumar has over ten years of experience in electronic packaging, with multi-disciplinary background encompassing package design, physical design/layout, signal/power integrity, substrate fabrication, Manufacturing, technology validation and product development. He currently serves as a Senior Manager for Design with Micron, USA. In this capacity, he works to push the technology envelope for both Flash and DRAM products with new package design developments. He has co-authored over 15 journal and conference publications, which have been cited over 450 times. He also has 5 United States Patents in the area of memory-logic integration. In addition, Dr. Kumar is a peer reviewer for a number of internationally reputable conferences and journals. He has also served on several technical panel committees, in addition to being the technical invited speaker at the IEEE Electronics Packaging Technology Conference last year. He received his PhD and MS specializing in Electrical and Computer Engineering, from the Georgia Institute of Technology.






Dr. Haley Fu





Dr. Toshihisa Nonaka





Prof. Y. P. Zhang








Dr. Shunichi Kikuchi




Mr.Erkko Helminen  





Dr. Gokul Kumar


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