List of Invited Speakers

Invited Speakers

·         Dr. Junsu Lee, Senior Packaging Scientist, Tyndall Research Institute, “Packaging of Integrated Silicon Photonic devices:  Electrical, Optical, Thermal Challenges and Applications”

·         Dr Napetschnig, Senior Staff Engineer, Infineon, Title TBC

·         Dr. Seung Wook Yoon, Director, Business Development, STATSChipPac Pte, Ltd., “Advanced eWLB FOWLP: Enabling Integrated Packaging Solutions”

·         Dr. Guilian Gao, Xperi, “Enhanced Bonding Technology for Hybrid Integration in 3D Packaging Technology”

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