Professional Development Courses

Professional Development Courses   

·         MEMS Fabrication and Packaging, Dr. Liu Aiqun, School of Electrical & Electronic Engineering College of Engineering Nanyang technological university, Singapore

·         Electronic Packaging for 5G Microwave and Millimeter Wave Systems, Dr. Rick Sturdivant, Department of Engineering and Computer Science & Department of Engineering and Computer Science, Azusa Pacific University, USA

·         Fan-Out Wafer-Level Packaging and 3D Packaging, Dr. John H Lau, ASM, Hong Kong

·         small volume interconnect reliability and failure mechanisms for power/automotive package, Dr. Mervi Paulasto-Kröckel, Department of Electrical Engineering and Automation, Aalto University, Finland

·         Advanced LED packaging technology and reliability, Dr. Shi-Wei Ricky Lee, LFASME, FIEEE, FInstP, LFIMAPS, Chair Professor of Mechanical & Aerospace Engineering, Hong Kong University of Science & Technology, Hong Kong

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