Call for Papers 

Submission start 

15 Mar 2023

Closing of abstract submission

31 May 2023

Click for more information: CFP 2023 

Technical Categories 

Advanced Packaging

TSV/Wafer Level Packaging

Interconnection Technologies

Emerging Technologies

Materials and Processing

Assembly and Manufacturing Technology

Electrical Simulation & Characterization

Mechanical Simulation & Characterization

Thermal Management& Characterization

Quality, Reliability & Failure Analysis

Advanced Optoelectronics and Displays

Smart Manufacturing and Equipment Technology