ABOUT EPTC 2022

The 24th IEEE Electronics Packaging Technology Conference (EPTC2022) is an international event organized by the IEEE RS/EPS/EDS Singapore Chapters and co-sponsored by the IEEE Electronics Packaging Society (EPS). Since its inauguration in 1997, EPTC has been established as a highly reputed international electronics packaging conference and is the EPS flagship conference in the Asia-Pacific Region. It aims to cover the complete spectrum of electronics packaging technology. Topics include modules, components, materials, equipment technology, assembly, reliability, interconnect design, device and systems packaging, heterogeneous integration, wafer-level packaging, flexible electronics, LED, IoT, 5G, emerging technologies, 2.5D/3D integration technology, smart manufacturing, automation and AI. EPTC2022 conference will feature keynotes, a panel, HIR Workshop, technical sessions, invited talks, PDCs, interactive sessions, packaging education workshop, an exhibition and networking activities.


The EPTC technical program Committee, with more than 100 experts from diverse technology areas in semiconductor packaging, is committed to creating an engaging technical program for the international packaging community. Technology Corner Exhibits will supplement the technical program, which will allow leading companies to exhibit their latest technologies and products. Last year, the 23rd EPTC was conducted on a virtual platform due to the pandemic. More than 496 attended from more than 30 countries worldwide, with 150 video presentations across 26 technical sessions. This year the conference will be in-person. Currently, fully-vaccinated persons need not be tested to enter Singapore, and no quarantine period is necessary


* From 26 April 26, all fully vaccinated visitors and non-fully vaccinated children aged 12 and below arriving into Singapore will no longer be required to take a Pre-Departure Test before departing for Singapore. Refer Singapore CVOID-19 advisory

EPTC 2022 Technical Categories 
Advanced Packaging
TSV/Wafer Level Packaging
Interconnection Technologies
Emerging Technologies
Materials and Processing
Assembly and Manufacturing Technology
Electrical Simulation & Characterization
Mechanical Simulation & Characterization
Thermal ManagementCharacterization
Quality, Reliability & Failure Analysis
Advanced Optoelectronics and Displays
Smart Manufacturing and Equipment Technology


  • Platinum Sponsor

  • Gold Sponsor

  • Gold Sponsor

  • Gold Sponsor

  • Gold Sponsor

  • Gold Sponsor

  • Silver Sponsor

  • Silver Sponsor

  • Exhibitor

  • Exhibitor

  • Partner Conference 

  • Partner Conference 

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