ABOUT EPTC 2021

The 23rd IEEE Electronics Packaging Technology Conference (EPTC2021) is an international event organized by the IEEE RS/EPS/EDS Singapore Chapters and co-sponsored by IEEE Electronics Packaging Society (EPS). EPTC2021 conference will feature keynotes, technical sessions, technology talks, exhibition corners and networking activities. It aims to provide a platform to cover the technology developments in the complete spectrum of electronics packaging from design to manufacturing. Since its inauguration in 1997, EPTC has established a highly reputed electronics packaging conference in Asia and selected as an EPS flagship conference in the Asia-Pacific Region 10, covering diverse areas of electronic packaging technology topics. These include modules, components, materials, equipment technology, assembly, reliability, interconnect design, device and systems packaging, heterogeneous integration, wafer-level packaging, flexible electronics, LED, Internet of things (IOT), 5G, autonomous vehicles, photonics, emerging technologies, 2.5D/3D integration technology and, smart manufacturing.


The EPTC technical program Committee, with more than 100 experts from diverse technology areas in semiconductor packaging, is committed to creating an engaging technical program for the packaging community. Last year, the 22nd EPTC was conducted on a virtual platform due to the pandemic. More than 680 attendees attended from more than 30 countries worldwide, with 135 video presentations across the 26 technical sessions. Additionally, technology talks from industry and academic experts have been introduced. The technical program and Technology talks will be supplemented by Exhibitors technology corner, which provide an opportunity for leading companies to exhibit their latest technologies and products. If the pandemic situation improves towards the end of the year and international travel restrictions are lifted, a hybrid conference mode may be introduced to include one or two days of in-person sessions.


CONFERENCE TOPICS

Advanced Packaging

TSV/Wafer Level Packaging

Interconnection Technologies

Emerging Technologies

Materials and Processing

Assembly and Manufacturing Technology

Electrical Simulation & Characterization

Mechanical Simulation & Characterization

Thermal Characterization & Cooling Solutions

Quality, Reliability & Failure Analysis

Photonics, Optoelectronics and Displays

Smart Manufacturing and Equipment Technology


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