The 25^th IEEE Electronics Packaging Technology Conference (EPTC2023) is an international event organized by the IEEE RS/EPS/EDS Singapore Chapters and co-sponsored by the IEEE Electronics Packaging Society (EPS). Since its inauguration in 1997, EPTC has been established as a highly reputed international electronics packaging conference and is the EPS flagship conference in the Asia-Pacific Region. It aims to cover the complete spectrum of electronics packaging technologies. This year is 25^th anniversary; EPTC 2023 will be 4 days event featuring Keynote talks, Technical sessions, Invited talks, Interactive sessions, Professional development courses, Panel session, Heterogeneous Integration Roadmap (HIR) workshop, Packaging education workshop. It is a good opportunity for the delegates to interact with peers / experts to exchange knowledge. The EPTC technical program Committee with more than 100 experts with diverse experience in semiconductor packaging will review and select best quality technical papers for the conference. The EPTC 2023 will hold Technology Exhibits supplementing the technical programs; leading semiconductor Packaging assembly & Test / Material / Equpment companies will exhibit their latest technologies and products. 

The conference technical topics include semiconductor modules /component / System packaging, 2.5D/3D/Heterogeneous Integration, Wafer-Level Packaging, Flexible electronics, LED, IoT, 5G, Emerging technologies, Interconnect design, Reliability, Materials, Equipment, Smart manufacturing, Automation and AI.