Technical Committee

Advanced Packaging

 

Navas KHAN, TC Chair

Infineon Technologies, Singapore

 

Min Woo RHEE, TC Co-Chair

Samsung Electronics, South Korea

 

Rainer DUDEK, TC Member

Fraunhofer ENAS, Germany

 

V C Muniandy KESVAKUMAR,

TC Member , Infineon Technologies, Singapore

 

Aditya KUMAR, TC Member

GlobalFoundries, USA

 

Jean-Charles SOURIAU, TC Member

CEA-LETI, France

 

C.S. FOONG, TC Member

NXP Semiconductor, Netherlands

 

Bok Eng CHEAH, TC Member

Intel, USA

 

Hyoung Joon KIM, TC Member

Qualcomm, USA

 

Nagendra Sekhar VASARLA, TC Member

Institute of Microelectronics, Singapore

 

Karsten MEIER, TC Member

TU Dresden, Germany

 

Thorsten MEYER, TC Member

Infineon Technologies, Germany



 

TSV/Wafer Level Packaging

 

Seung Wook YOON,

TC Chair

Samsung Electronics, South Korea

 

Mark HUANG, TC Co-Chair

Suzhou SPEED Semiconductor Technology Pte Ltd, China

 

Ranjan RAJOO, TC Member

GlobalFoundries, Singapore

 

Kuoming CHEN, TC Member

UMC, Taiwan

 

Gaurav SHARMA, TC Member

GlobalFoundries, USA

 

Seung Taek YANG, TC Member

SK Hynix, South Korea

 

Jaesik LEE, TC Member

Nvidia, USA

 

Mingliang HUANG, TC Member

Dalian University of Technology, China

 

Boo Yang JUNG, TC Member

SK Hynix, South Korea

 

Thorsten MEYER, TC Member

Infineon Technologies, Germany

 

Steffen KROEHNERT, TC Member

ESPAT-Consulting, Germany

 

Yann GUILLOU, TC Member

Trymax Semiconductor, Netherlands

 

Gao SHAN, TC Member

Huawei International, Singapore

 

Chee Ping LEE, TC Member

Lam Research, Singapore

 

Wei ZHOU, TC Member

Micron Technology, USA

 

Rama Krishna KOTLANKA, TC Member

Analog Devices, USA

 

Sungdong KIM, TC Member

Seoul National University of Science and Technology, South Korea

 

 

Assembly and Manufacturing Technology

 

Ranjan RAJOO, TC Chair

GlobalFoundries, Singapore

 

Chandra BHESETTI, TC Co-Chair

Institute of Microelectronics, Singapore

 

Yunbo HE, TC Member

Guangdong University of Technologies, China

 

Prayudi LIANTO, TC Member

Applied Materials, Singapore

 

Chee Ping LEE, TC Member

Lam Research, Singapore

 

Rathin MANDAL, TC Member

Institute of Microelectronics, Singapore

 

Haruchi KANAYA, TC Member

Kyushu University, Japan

 

Dongshun BAI, TC Member

Brewer Science, Singapore

 

Eric J.R. PHUA, TC Member

Nanofilm Technologies International, Singapore

 

Tingyu Leon LIN, TC Member

Guangdong Fozhixin Microelectronics Research, China



 

Quality, Reliability & Failure Analysis

 

Alfred YEO, TC Chair

Advanced Micro Devices, Singapore

 

Ming XUE, TC Co-Chair

Infineon Technologies, Singapore

 

Christian BIRZER, TC Member

Infineon Technologies, Germany

 

Xuejun FAN, TC Member

Lamar University, USA

 

Keith NEWMAN, TC Member

Advanced Micro Devices, Singapore

 

Hong Wan NG, TC Member

Micron Semiconductor, Singapore

 

Shaw Fong WONG, TC Member

Intel, Malaysia

 

Chin Hui CHONG, TC Member

Micron Technology, Singapore

 

Lei Jun TANG, TC Member

Institute of Microelectronics, Singapore

 

Ai Kiar ANG, TC Member

IBM, Singapore

 

Haohui LONG, TC Member

Huawei Technologies., China

 

Stevan G HUNTER, TC Member

Arizona State University, USA

 

 

Interconnection Technologies

 

Liming SHEN, TC Chair

Kulicke & Soffa, Singapore

 

Hong Meng HO, TC Co-Chair

Infineon Technologies, Singapore

 

Horst CLAUBERG, TC Member

Kulicke & Soffa, USA

 

Wei FAN, TC Member

Singapore Institute of Manufacturing Technology, Singapore

 

Nga Phuong PHAM, TC Member

IMEC, Belgium

 

Daquan YU, TC Member

Chinese Academy of Science, China

 

David HUTT, TC Member

Loughborough University, UK

 

Jack XIONG, TC Member

Qorvo, Singapore

 

Tanemasa ASANO, TC Member

Kyushu University, Japan

 

Kyung W. PAIK, TC Member

KAIST, South Korea

 

Lois LIAO, TC Member

Wintech Nano-Technology Services, Singapore

 

Lam WAI, TC Member

Nexperia, Hong Kong

 

Serguei STOUKATCH, TC Member

Liege University, Belgium



 

Electrical Simulations & Characterization

 

Mihai ROTARU, TC Chair

Institute of Microelectronics, Singapore

 

Bruce KIM, TC Co-Chair

City University of New York, USA

 

Aoyagi MASAHIRO, TC Member

AIST, Japan

 

Weerasekera ROSHAN, TC Member

University of the West of England, UK

 

Arif ENGIN, TC Member

San Diego State University, USA

 

Fujiang LIN, TC Member

USTC, China

 

Jianyong XIE, TC Member

Intel, USA

 

Chetan VERMA, TC Member

NXP Semiconductors, India

 

Fei GOU, TC Member

Advanced Micro Devices, Canada

 

Jackson KONG, TC Member

Intel, Malaysia

 

Sungho KANG, TC Member

Yonsei University, South Korea

 

En-Xiao LIU, TC Member

Institute of High Performance Computing, Singapore



 

Mechanical Simulation & Characterization

 

Andrew TAY, TC Chair

National University of Singapore, Singapore

 

Shan GAO, TC Co-Chair

Huawei Technologies, Singapore

 

Kuo Ning CHIANG, TC Member

National Tsing Hua University, Taiwan

 

Juergen AUERSPERG, TC Member

Fraunhofer ENAS, Germany

 

Wei ZHOU, TC Member

Micron Technology, Singapore

 

Richard RAO, TC Member

Marvell Technology, USA

 

Xiaowu ZHANG, TC Member

Institute of Microelectronics, Singapore

 

Christopher BAILEY, TC Member

University of Greenwich, UK

 

Rathin MANDAL, TC Member

Institute of Microelectronics, Singapore

 

Yong LIU, TC Member

ON Semiconductor, USA

 

Jeff SUHLING, TC Member

University of Auburn, USA

 

Rainer DUDEK, TC Member

Fraunhofer ENAS, Germany

 

Ah-Young PARK, TC Member

Korea Institute of Machinery and Materials, South Korea

 

Qiang YU, TC Member

Yokohama National University, Japan

 

SB Park, TC Member

Binghamton University, USA

 


Advanced Optoelectronics and Displays

 

Haohui LONG , TC Chair

Huawei Technologies, China       

   

Wenhui ZHU, TC Co-Chair

Central South University, China

 

Jianhua ZHANG, TC Member     

Shanghai University, China

 

Xueren ZHANG, TC Member          

Xilinx, Singapore

 

Zhang LI, TC Member  

Huawei Technologies, China       

 

Zheng GONG, TC Member  

Guangdong Institute of Semiconductor Industrial Technology, China

 

Nagendra Sekhar VASARLA, TC Member

Institute of Microelectronics, Singapore

 

Horst CLAUBERG, TC Member

Kulicke & Soffa, USA

 

Wolfgang REINERT, TC Member

Fraunhofer Institute for Silicon Technology, Germany

 

Liancheng WANG, TC Member

Central South University, China

 

Zi-Hui ZHANG, TC Member

Hebei University of Technology, China

 

Xiaoyan YI, TC Member

Institute of Semiconductor, China

 

Anlian PAN, TC Member

Hunan University, China

 

Sung-Min LEE, TC Member

Kookmin University, South Korea

 

Yang ZHOU, TC Member

Wuhan University, China

 

Xuan CAO, TC Member

Chengdu Vistar Optoelectronics, China

 

 

 

 

 

 

 

Emerging Technologies

 

Kripesh VAIDYANATHAN,

TC Chair

Institute of Technical Education, Singapore

 

Martin OPPERMANN,

TC Co-Chair

Dresden University of Technology, Germany

 

Perceval COUDRAIN, TC Member

CEA-LETI, France

 

Toni MATTILA, TC Member

Aalto University Espoo, Finland

 

Nga Phuong PHAM. TC Member

IMEC, Belgium

 

Wolfgang REINERT, TC Member

Fraunhofer Institute for Silicon Technology, Germany

 

Thomas ZERNA, TC Member

Dresden University of Technology, Germany

 

Yufeng YAO, TC Member

Broadcom, Singapore

 

Rama Krishna KOTLANKA, TC Member

Analog Devices, USA

 

Suan Hui PU, TC Member

University of Southampton, Malaysia

 


Materials and Processing

 

Chin Hock TOH, TC Chair

Packaging Professional, Singapore

           

Alvin LEE, TC Co-Chair

Brewer Science, Taiwan

 

Chee Lip GAN, TC Member

Nanyang Technological University, Singapore

 

Sungdong KIM, TC Member

Seoul National University of Science & Technology, South Korea

 

Kim Shyong SIOW, TC Member

Universiti Kebangsaan Malaysia, Malaysia

 

Changqing LIU, TC Member

Loughborough University, UK

 

Vempati Srinivasa RAO, TC Member

Institute of Microelectronics, Singapore

 

Suan Hui PU, TC Member

University of Southampton, Malaysia

 

Yu-Po WANG, TC Member

Siliconware Precision Industries, Taiwan

 

SS KANG, TC Member

Heraeus, Singapore

 

An XIAO, TC Member

Ampleon, Netherlands

 

Lewis HUANG, TC Member

Senju Metal Industry, Taiwan

 

Santosh Kumar RATH, TC Member

Applied Materials, Singapore

 

Albert LAN, TC Member

Applied Materials, Taiwan

 


Thermal Management and Characterization

 

Rathin MANDAL, TC Chair

Institute of Microelectronics, Singapore

 

Marta RENCZ, TC Co-Chair

Mentor Graphics - MicReD, Hungary

 

Yogendra JOSHI, TC Member

Georgia Institute of Technology, USA

 

Justin A. WEIBEL, TC Member

Purdue University, USA

 

Hengyun ZHANG, TC Member

Shanghai University of Engineering Science, China

 

Marcin JANICKI, TC Member

Lodz University of Technology, Poland

 

Yong HAN, TC Member

Institute of Microelectronics, Singapore

 

Kazuyoshi FUSHINOBU, TC Member

Tokyo Institute of Technology, Japan

 

Ye HONG, TC Member

University of Science and Technology, China

 

Codecasa LORENZO, TC Member

Politecnico di Milano, Italy

 

Pengfei LI, TC Member

Huawei Technologies, China

 

Shankar S, TC Member

Shiretechnik Solutions, India

 

Yan XU, TC Member

Huawei Technologies, China

 

Shreyas BINDIGANAVALE, TC Member

Advanced Micro Devices, Singapore

 

Gamal REFAI-AHMED, TC Member

Xilinx, USA

 

Andy WANG, TC Member

Xilinx, USA

 

Tiwei WEI, TC Member

Stanford University, USA

 

Smart Manufacturing & Equipment Technology

 

Chandra BHESETTI, TC Chair

Institute of Microelectronics, Singapore

 

Arthur WEE, TC Member

Infineon Technologies, Singapore

 

Wint PHYU, TC Member

Kulicke & Soffa, Singapore

 

Ai Kiar ANG, TC Member

IBM, Singapore

 

Tick Kwang LOH, TC Member

Kulicke & Soffa, Singapore 

 

Ephraim SUHIR, TC Member

Portland State University, USA


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