Technical Committee 2019


Advanced Packaging

Role Name Organisation
Chair Navas KHAN Infineon Technologies
Co-chair Rainer Dudek Fraunhofer ENAS
Member V.P GANESH Infineon Technologies
Member Aditya Kumar GLOBALFOUNDRIES
Member Jean-Charles SOURIAU LETI
Member Vempati SRINIVAS Institute of Microelectronics
Member C.S. Foong NXP Semiconductor
Member Bok Eng CHEAH Intel Microelectronics
Member KIM Hyoung Joon Qualcomm
Member Jatinder Kumar Semtech
Member  Vasarla Nagendra Sekhar Institute of Microelectronics
Member Karsten Meier Technische Universität Dresden 
Member  Min Woo Rhee  Samsung Electronics


TSV/Wafer Level Packaging
Role Name Organisation
Chair Dr. YOON Seung Wook Statschippac Pte LTD
Co-Chair Dr. Mark Huang Suzhou SPEED Semiconductor Technology Pte Ltd), China
Member Mr. Ranjan Rajoo Global Foundries, Singapore
Member Dr. CHEN Kuoming UMC, Taiwan
Member Dr. GAURAV Sharma Global Foundries, US
Member Mr. YANG Seung Taek SK Hynix Semiconductor, Korea
Member Dr. LEE Jaesik nVidia, US
Member Dr. Mingliang HUANG Dalian University of Technology, China
Member Dr. JUNG Boo Yang Global Foundries, Singapore
Member Mr. Thorsten Meyer Infineon AG, Germany
Member Mr. Kroehnert Steffen Nanium
Member Mr. Santosh KUMAR Yole Development
Member Mr. Yann Guillou Trymax Semi, Netherlands


Interconnect Technologies

RoleNameOrganisation
ChairDavid HUTTLoughborough University
Co-chairLiming SHENKulicke & Soffa, Singapore
MemberHorst CLAUBERGKnS
MemberWei FANSingapore Institute of Manufacturing Technology
MemberHong Meng HOInfineon
MemberJames HOWSingapore
MemberYew Cheong MUI Advanced Micro Devices, Singapore
MemberNga Phuong PHAMIMEC, Belgium
MemberDaquan YUChinese Academy of Science, China
MemberJack XIONGQorvo, Singapore
Member Tanemasa ASANO Kyushu University
Member Kyung W. PaikKAIST
Member Lois Liao Wintech Nano-technology Services Pte Ltd, 


Emerging Technologies

RoleNameOrganisation
ChairKripesh VAIDYANATHANITE, Singapore
Co-chairMartin OPPERMANN Dresden University of Technology
MemberPerceval COUDRAINCEA-Leti 
MemberToni MATTILAAalto University Espoo 
MemberNga Phuong PHAMIMEC
MemberWolfgang REINERTFraunhofer Institute for Silicon Technology
Member Thomas ZERNADresden University of Technology
Member Yufeng YaoBroadcom Ltd (Avago Technologies)
Member Rama Krishna KotlankaAnalog Devices
MemberAlexander KlemmRobert Bosch GmbH
MemberPaul GierthFraunhofer Institute for Ceramic Technologies Systems


Materials and Processing

RoleNameOrganisation
ChairDr Chin Hock TOH 
Co-chairDr Won Kyoung CHOISTATS ChipPAC Ltd, Singapore
MemberProf. Chee Lip GANNanyang Technological University, Singapore
MemberProf. Sungdong KIMSeoul National University of Science & Technology, Korea
MemberDr Kim Shyong SIOWUniversity Kebangsaan Malaysia, Malaysia
MemberAlvin LEEBrewer Science, Taiwan
MemberProf. Changqing LIULoughborough University, UK
MemberDr Lim Chong SIMIntel, Malaysia
MemberProf. Chuan Seng TANNanyang Technological University, Singapore
MemberVempati Srinivasa RAOIME, Singapore
MemberDr Jun WEISingapore Institute of Manufacturing Technology,
MemberChin-Yu (Max) LUSiliconware Precision Industries Ltd, Taiwan
MemberDr Suan Hui PUUniversity of Southampton, Malaysia
MemberYuentuck, Wu Dupont


Assembly and Manufacturing Technology

Role Name Organisation
Chair James How Singapore
Co-chair Chandra BHESETTI Lam Research
Member  Dr He Yunbo Guangdong University of Technologies
Member  Dr Prayudi Lianto Applied Materials, Singapore
Member  Lee Chee Ping  Lam Research
Member  Rathin MANDAL Advanced Micro Devices Singapore,
Member  Prof Haruchi Kanaya  Kyushu University
Member  Dr Bai Dongshun  Brewer Science 
Member  Dr Eric JR Phua Nanyang Technological University


Electrical Simulations and Characterization 
RoleNameOrganisation
ChairWui Weng WongAMD, Singapore
Co-chairMihai RotaruU. of Southampton, U.K.
Co-chairBruce KIMCity University of New York
MemberAoyagi MasahiroAIST, Japan
MemberWeerasekera RoshanUniversity of the West of England (UWE)
MemberEngin EgeSan Diego State University , USA
MemberFujiang LinUSTC, China
MemberJianyong Xie Intel, USA
MemberChetan VermaNXP, India
MemberFei GouAMD, Canada
MemberJackson KongIntel, Malaysia
MemberSungho KANG Yonsei University, Korea
MemberEn-Xiao LIU Institute of High Performance Computing, Singapore


Mechanical Simulation and Characterization
RoleNameOrganisation
ChairAndrew TAYNational University of Singapore, Singapore
Co-chairShan GAOHuawei, Singapore
MemberDaoguo Yang Guilin University of Electronic Technology, China
MemberKuo Ning CHIANGNational Tsing Hua University,Taiwan
MemberLeo ERNSTErnst Consultant
MemberJuergen AuerspergFraunhofer ENAS, Germany
MemberWei ZhouMicron, Singapore
MemberEric YongInfineon Technologies Asia Pacific, Singapore
MemberRichard RaoMicrosemi
MemberXiaowu ZHANGInstitute of Microelectronics,Singapore
MemberChristopher BaileyUniversity of Greenwich, UK 
MemberRathin MANDALAdvanced Micro Devices Singapore, Singapore
Member Yong LiuOn Semiconductor
MemberJeff SuhlingUniversity of Auburn, USA
Member Akash Agarwal  




Thermal Characterization and Cooling Solutions

RoleNameOrganisation
ChairRathin MANDALAdvanced Micro Devices Singapore, Singapore
Co-chairMarta RENCZMentor Graphics - MicReD, Hungary
MemberWataru NAKAYAMATherm Tech International, Japan
MemberYogendra JOSHIGeorgia Institute of Technology, USA
MemberSandeep TONAPIAnveshak Technology and Knowledge Solutions, USA
MemberJustin A. WEIBELPurdue University, USA
MemberHengyun ZHANGShanghai University of Engineering Science, China
MemberMarcin JANICKI Lodz University of Technology, Poland
MemberYong HANInstitute of Microelectronics (A-star), Singapore
MemberKazuyoshi FUSHINOBUTokyo Institute of Technology, Japan
MemberYe HONGUniversity of Science and Technology, China
MemberCodecasa LORENZOPolitecnico di Milano, Italy
MemberPengfei LIHuawei Technologies, China
MemberShankar SShiretechnik Solutions Pvt Ltd, India
MemberGabor FarkasMentor Graphics - MicReD, Hungary



Quality, Reliability and Failure Analysis
RoleNameOrganisation
ChairAlfred YEOInfineon, Singapore
Co-Chair Tong Yan TEESMARTS Enterprise, Singapore
MemberChristian BIRZERInfineon Technologies, Germany
MemberXuejun FANLamar University , United States
MemberYi-Shao LAIASE, Taiwan
MemberStefano MARIANIPolitecnico di Milano, Italy
MemberKeith NEWMANAMD
MemberHong Wan NGMicron, Singapore
MemberShaw Fong WONGIntel, Malaysia
MemberChin Hui CHONGMicron, Singapore
MemberLei Jun TANGA*STAR, IME,Singapore
MemberZhibin XIEHeptagon Micro Optics Pte Ltd
MemberAi Kiar ANGIBM ,Singapore
MemberHaohui LONGHuawei Device Co.,Ltd., China
MemberStevan G HunterON Semiconductor



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