Technical Committee 2018
Advanced Packaging
Chair Navas KHAN Infineon Technologies
Co-chair Rainer Dudek Fraunhofer ENAS
Member V.P GANESH Infineon Technologies
Member Aditya Kumar GLOBALFOUNDRIES
Member Jean-Charles SOURIAU LETI
Member Vempati SRINIVAS Institute of Microelectronics
Member C.S. Foong NXP Semiconductor
Member Bok Eng CHEAH Intel Microelectronics
Member KIM Hyoung Joon Qualcomm
Member Jatinder Kumar Semtech
Member  Nagendra Sekhar Institute of Microelectronics
Member Karsten Meier Universität Dresden 
Member  Min Woo Rhee  Samsung Electronics
TSV/Wafer Level Packaging
Chair YOON Seung Wook Statschippac Pte LTD
Co-Chair Mark Huang Suzhou SPEED Semiconductor Technology Pte Ltd
Member Ranjan Rajoo Global Foundries, Singapore
Member CHEN Kuoming UMC, Taiwan
Member GAURAV Sharma NXP, US
Member YANG Seung Taek SK Hynix Semiconductor, Korea
Member LEE Jaesik nVidia, US
Member Mingliang HUANG Dalian University of Technology, China
Member JUNG Boo Yang Global Foundries, Singapore
Member Thorsten Meyer Infineon AG, Germany
Member Kroehnert Steffen Nanium
Member Santosh KUMAR Yole Development
Member Yann Guillou Trymax Semi, Netherlands
Interconnect Technologies
Chair David HUTT Loughborough University
Co-chair Liming SHEN Kulicke & Soffa, Singapore
Member Horst CLAUBERG Kulicke & Soffa, Singapore
Member Wei FAN Singapore Institute of Manufacturing Technology
Member Hong Meng HO Infineon
Member James HOW Singapore
Member Yew Cheong MUI  Advanced Micro Devices, Singapore
Member Nga Phuong PHAM IMEC, Belgium
Member Daquan YU Chinese Academy of Science, China
Member Jack XIONG Qorvo, Singapore
Member  Tanemasa ASANO  Kyushu University
Member  Kyung W. Paik KAIST
Member  Lois Liao  Wintech Services Pte Ltd, 
Emerging Technologies
Chair Kripesh VAIDYANATHAN ITE, Singapore
Co-chair Martin OPPERMANN  Dresden University of Technology
Member Perceval COUDRAIN CEA-Leti 
Member Toni MATTILA Aalto University Espoo 
Member Nga Phuong PHAM IMEC
Member Wolfgang REINERT Fraunhofer Institute for Silicon Technology
Member  Thomas ZERNA Dresden University of Technology
Member  Yufeng Yao Broadcom Ltd (Avago Technologies)
Member  Rama Krishna Kotlanka Analog Devices
Member Alexander Klemm Robert Bosch GmbH
Member Paul Gierth Fraunhofer Institute for Ceramic Technologies Systems
Materials and Processing
Chair Chin Hock TOH  
Co-chair Won Kyoung CHOI STATS ChipPAC Ltd, Singapore
Member Chee Lip GAN Nanyang Technological University, Singapore
Member Sungdong KIM Seoul National University of Science & Technology, Korea
Member Kim Shyong SIOW University Kebangsaan Malaysia, Malaysia
Member Alvin LEE Brewer Science, Taiwan
Member Changqing LIU Loughborough University, UK
Member Lim Chong SIM Intel, Malaysia
Member Chuan Seng TAN Nanyang Technological University, Singapore
Member Vempati Srinivasa RAO IME, Singapore
Member Jun WEI Singapore Institute of Manufacturing Technology,
Member Chin-Yu (Max) LU Siliconware Precision Industries Ltd, Taiwan
Member Suan Hui PU University of Southampton, Malaysia
Member Yuentuck Wu  Dupont
Assembly and Manufacturing Technology
Chair James How Singapore
Co-chair Chandra BHESETTI Lam Research
Member  He Yunbo Guangdong University of Technologies
Member  Prayudi Lianto Applied Materials, Singapore
Member  Lee Chee Ping  Lam Research
Member  Rathin MANDAL Advanced Micro Devices Singapore,
Member  Haruchi Kanaya  Kyushu University
Member  Bai Dongshun  Brewer Science 
Member  Eric JR Phua Nanyang Technological University
Electrical Simulations and Characterization 
Chair Wui Weng Wong AMD, Singapore
Co-chair Mihai Rotaru U. of Southampton, U.K.
Co-chair Bruce KIM City University of New York
Member Aoyagi Masahiro AIST, Japan
Member Weerasekera Roshan University of the West of England (UWE)
Member Engin Ege San Diego State University , USA
Member Fujiang Lin USTC, China
Member Jianyong Xie  Intel, USA
Member Chetan Verma NXP, India
Member Fei Gou AMD, Canada
Member Jackson Kong Intel, Malaysia
Member Sungho KANG Yonsei University, Korea
Member En-Xiao LIU  Institute of High Performance Computing
Mechanical Simulation and Characterization
Chair Andrew TAY Singapore University of Technology and Design
Co-chair Shan GAO Huawei, Singapore
Member Daoguo Yang Guilin University of Electronic Technology, China
Member Kuo Ning CHIANG National Tsing Hua University,Taiwan
Member Leo ERNST Ernst Consultant
Member Juergen Auersperg Fraunhofer ENAS, Germany
Member Wei Zhou Micron, Singapore
Member Eric Yong Infineon Technologies Asia Pacific, Singapore
Member Richard Rao Microsemi
Member Xiaowu ZHANG Institute of Microelectronics,Singapore
Member Christopher Bailey University of Greenwich, UK 
Member Rathin MANDAL Advanced Micro Devices Singapore, Singapore
Member  Yong Liu On Semiconductor
Member Jeff Suhling University of Auburn, USA
Member                           Premachandran CS   Globalfoundries, USA
Member                         Akash Agarwa
 
Thermal Characterization and Cooling Solutions
Chair Rathin MANDAL Advanced Micro Devices Singapore
Co-chair Marta RENCZ Mentor Graphics - MicReD, Hungary
Member Wataru NAKAYAMA Therm Tech International, Japan
Member Yogendra JOSHI Georgia Institute of Technology, USA
Member Sandeep TONAPI Anveshak Technology and Knowledge Solutions, USA
Member Justin A. WEIBEL Purdue University, USA
Member Hengyun ZHANG Shanghai University of Engineering Science, China
Member Marcin JANICKI  Lodz University of Technology, Poland
Member Yong HAN Institute of Microelectronics (A-star), Singapore
Member Kazuyoshi FUSHINOBU Tokyo Institute of Technology, Japan
Member Ye HONG University of Science and Technology, China
Member Codecasa LORENZO Politecnico di Milano, Italy
Member Pengfei LI Huawei Technologies, China
Member Shankar S Shiretechnik Solutions Pvt Ltd, India
Member Gabor Farkas Mentor Graphics - MicReD, Hungary
Quality, Reliability and Failure Analysis
Chair Alfred YEO Infineon, Singapore
Co-Chair  Tong Yan TEE SMARTS Enterprise, Singapore
Member Christian BIRZER Infineon Technologies, Germany
Member Xuejun FAN Lamar University , United States
Member Yi-Shao LAI ASE, Taiwan
Member Stefano MARIANI Politecnico di Milano, Italy
Member Keith NEWMAN AMD
Member Hong Wan NG Micron, Singapore
Member Shaw Fong WONG Intel, Malaysia
Member Chin Hui CHONG Micron, Singapore
Member Lei Jun TANG IME,Singapore
Member Zhibin XIE Heptagon Micro Optics Pte Ltd
Member Ai Kiar ANG IBM ,Singapore
Member Haohui LONG Huawei Device Co.,Ltd., China
Member Stevan G Hunter ON Semiconductor



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