Technical Committee 2018

Advanced Packaging

RoleNameOrganisation
ChairNavas KalandarInfineon Technologies
Co-chairRainer DudekFraunhofer ENAS
MemberV.P GANESHInfineon Technologies
MemberAditya KumarGLOBALFOUNDRIES
MemberJean-Charles SOURIAULETI
MemberVempati SRINIVASInstitute of Microelectronics
MemberC.S. FoongNXP Semiconductor
MemberBok Eng CHEAHIntel Microelectronics
MemberKIM Hyoung JoonQualcomm
MemberJatinder KumarSemtech
Member Vasarla Nagendra SekharInstitute of Microelectronics
New member Dr.-Ing. Karsten MeierTechnische Universität Dresden ;  
TSV/Wafer Level Packaging

RoleNameOrganisation
ChairDr. YOON Seung WookStatschippac Pte LTD
Co-ChairDr. Mark HuangSuzhou SPEED Semiconductor Technology Pte Ltd), China
MemberMr. Ranjan RajooGlobal Foundries, Singapore
MemberDr. CHEN KuomingUMC, Taiwan
MemberDr. GAURAV SharmaGlobal Foundries, US
MemberMr. YANG Seung TaekSK Hynix Semiconductor, Korea
MemberDr. LEE JaesiknVidia, US
MemberDr. Mingliang HUANGDalian University of Technology, China
MemberDr. JUNG Boo YangGlobal Foundries, Singapore
MemberMr. Thorsten MeyerInfineon AG, Germany
MemberMr. Kroehnert SteffenNanium
MemberMr. Santosh KUMARYole Development
Interconnection Technologies


RoleNameOrganisation
ChairDavid HUTTLoughborough University
Co-chairLiming SHENKulicke & Soffa, Singapore
MemberHorst CLAUBERGKnS
MemberWei FANSingapore Institute of Manufacturing Technology
MemberHong Meng HOInfineon
MemberJames HOWSingapore
MemberYew Cheong MUI Advanced Micro Devices, Singapore
MemberNga Phuong PHAMIMEC, Belgium
MemberDaquan YUChinese Academy of Science, China
MemberJack XIONGQorvo, Singapore
New member Tanemasa ASANO Kyushu University
New member Kyung W. PaikKAIST



Emerging Technologies


RoleNameOrganisation
ChairKripesh VAIDYANATHANITE, Singapore
Co-chairMartin OPPERMANN Dresden University of Technology
MemberPerceval COUDRAINSTMicroelectronics
MemberToni MATTILAAalto University Espoo 
MemberNga Phuong PHAMIMEC
MemberWolfgang REINERTFraunhofer Institute for Silicon Technology
Member Thomas ZERNADresden University of Technology
Member Yufeng YaoBroadcom Ltd (Avago Technologies)
Member Rama Krishna KotlankaAnalog Devices
MemberAlexander KlemmRobert Bosch GmbH
MemberPaul GierthFraunhofer Institute for Ceramic Technologies Systems
Materials and Processing


RoleNameOrganisation
ChairDr Chin Hock TOH 
Co-chairDr Won Kyoung CHOISTATS ChipPAC Ltd, Singapore
MemberProf. Chee Lip GANNanyang Technological University, Singapore
MemberProf. Sungdong KIMSeoul National University of Science & Technology, Korea
MemberDr Kim Shyong SIOWUniversity Kebangsaan Malaysia, Malaysia
MemberAlvin LEEBrewer Science, Taiwan
MemberProf. Changqing LIULoughborough University, UK
MemberDr Lim Chong SIMIntel, Malaysia
MemberProf. Chuan Seng TANNanyang Technological University, Singapore
MemberVempati Srinivasa RAOIME, Singapore
MemberDr Jun WEISingapore Institute of Manufacturing Technology, Singapore
MemberChin-Yu (Max) LUSiliconware Precision Industries Ltd, Taiwan
MemberDr Suan Hui PUUniversity of Southampton, Malaysia
New MemberYuentuck, Wu Dupont


Equipment and Process Automation

RoleNameOrganisation
ChairJames HowSingapore
Co-chairChandra BHESETTILam Research
Member Dr He YunboGuangdong University of Technologies
Member Dr Prayudi LiantoApplied Materials, Singapore
Member LEE, CHEE PING Lam Research

Electrical Simulations and Characterization 


RoleNameOrganisation
ChairWui Weng WongAMD, Singapore
Co-chairMihai RotaruU. of Southampton, U.K.
Co-chairBruce KIMCity University of New York
MemberAoyagi MasahiroAIST, Japan
MemberWeerasekera RoshanUniversity of the West of England (UWE)
MemberEngin EgeSan Diego State University , USA
MemberFujiang LinUSTC, China
MemberJianyong Xie Intel, USA
MemberChetan VermaNXP, India
new MemberFei GouAMD, Canada
MemberJackson KongIntel, Malaysia
MemberSungho KANGYonsei University, Korea
MemberEn-Xiao LIUInstitute of High Performance Computing, Singapore
Mechanical Simulation and Characterization


RoleNameOrganisation
ChairAndrew TAYNational University of Singapore, Singapore
Co-chairShan GAOHuawei, Singapore
MemberDaoguo Yang Guilin University of Electronic Technology, China
MemberKuo Ning CHIANGNational Tsing Hua University,Taiwan
MemberLeo ERNSTErnst Consultant
MemberJuergen AuerspergFraunhofer ENAS, Germany
MemberWei ZhouMicron, Singapore
MemberEric YongInfineon Technologies Asia Pacific, Singapore
MemberRichard RaoMicrosemi
MemberXiaowu ZHANGInstitute of Microelectronics,Singapore
MemberChristopher BaileyUniversity of Greenwich, UK 
MemberRathin MANDALAdvanced Micro Devices Singapore, Singapore
New Member Yong LiuOn Semiconductor
New MemberJeff SuhlingUniversity of Auburn, USA

Thermal Characterization and Cooling Solutions



RoleNameOrganisation
ChairRathin MANDALAdvanced Micro Devices Singapore, Singapore
Co-chairMarta RENCZMentor Graphics - MicReD, Hungary
MemberWataru NAKAYAMATherm Tech International, Japan
MemberYogendra JOSHIGeorgia Institute of Technology, USA
MemberSandeep TONAPIAnveshak Technology and Knowledge Solutions, USA
MemberJustin A. WEIBELPurdue University, USA
MemberHengyun ZHANGShanghai University of Engineering Science, China
MemberMarcin JANICKI Lodz University of Technology, Poland
MemberYong HANInstitute of Microelectronics (A-star), Singapore
New MemberKazuyoshi FUSHINOBUTokyo Institute of Technology, Japan
New MemberYe HONGUniversity of Science and Technology, China
New MemberCodecasa LORENZOPolitecnico di Milano, Italy
New MemberPengfei LIHuawei Technologies, China

Quality, Reliability and Failure Analysis

RoleNameOrganisation
ChairAlfred YEOInfineon, Singapore
Co-Chair Tong Yan TEESMARTS Enterprise, Singapore
MemberChristian BIRZERInfineon Technologies, Germany
MemberXuejun FANLamar University , United States
MemberYi-Shao LAIASE, Taiwan
MemberStefano MARIANIPolitecnico di Milano, Italy
MemberKeith NEWMANAMD
MemberHong Wan NGMicron, Singapore
MemberShaw Fong WONGIntel, Malaysia
MemberChin Hui CHONGMicron, Singapore
MemberLei Jun TANGA*STAR, IME,Singapore
MemberZhibin XIEHeptagon Micro Optics Pte Ltd
New MemberAi Kiar ANGIBM ,Singapore
New MemberHaohui LONGHuawei Device Co.,Ltd., China
New MemberStevan G HunterON Semiconductor



Top