Technical Committee 2018

Advanced Packaging

Role Name Organisation
Chair Navas KHAN Infineon Technologies
Co-chair Rainer Dudek Fraunhofer ENAS
Member V.P GANESH Infineon Technologies
Member Aditya Kumar GLOBALFOUNDRIES
Member Jean-Charles SOURIAU LETI
Member Vempati SRINIVAS Institute of Microelectronics
Member C.S. Foong NXP Semiconductor
Member Bok Eng CHEAH Intel Microelectronics
Member KIM Hyoung Joon Qualcomm
Member Jatinder Kumar Semtech
Member  Vasarla Nagendra Sekhar Institute of Microelectronics
New member  Dr.-Ing. Karsten Meier Technische Universität Dresden ;  
TSV/Wafer Level Packaging

Role Name Organisation
Chair Dr. YOON Seung Wook Statschippac Pte LTD
Co-Chair Dr. Mark Huang Suzhou SPEED Semiconductor Technology Pte Ltd), China
Member Mr. Ranjan Rajoo Global Foundries, Singapore
Member Dr. CHEN Kuoming UMC, Taiwan
Member Dr. GAURAV Sharma Global Foundries, US
Member Mr. YANG Seung Taek SK Hynix Semiconductor, Korea
Member Dr. LEE Jaesik nVidia, US
Member Dr. Mingliang HUANG Dalian University of Technology, China
Member Dr. JUNG Boo Yang Global Foundries, Singapore
Member Mr. Thorsten Meyer Infineon AG, Germany
Member Mr. Kroehnert Steffen Nanium
Member Mr. Santosh KUMAR Yole Development
Interconnection Technologies


Role Name Organisation
Chair David HUTT Loughborough University
Co-chair Liming SHEN Kulicke & Soffa, Singapore
Member Horst CLAUBERG KnS
Member Wei FAN Singapore Institute of Manufacturing Technology
Member Hong Meng HO Infineon
Member James HOW Singapore
Member Yew Cheong MUI  Advanced Micro Devices, Singapore
Member Nga Phuong PHAM IMEC, Belgium
Member Daquan YU Chinese Academy of Science, China
Member Jack XIONG Qorvo, Singapore
New member  Tanemasa ASANO  Kyushu University
New member  Kyung W. Paik KAIST



Emerging Technologies


Role Name Organisation
Chair Kripesh VAIDYANATHAN ITE, Singapore
Co-chair Martin OPPERMANN  Dresden University of Technology
Member Perceval COUDRAIN STMicroelectronics
Member Toni MATTILA Aalto University Espoo 
Member Nga Phuong PHAM IMEC
Member Wolfgang REINERT Fraunhofer Institute for Silicon Technology
Member  Thomas ZERNA Dresden University of Technology
Member  Yufeng Yao Broadcom Ltd (Avago Technologies)
Member  Rama Krishna Kotlanka Analog Devices
Member Alexander Klemm Robert Bosch GmbH
Member Paul Gierth Fraunhofer Institute for Ceramic Technologies Systems
Materials and Processing


Role Name Organisation
Chair Dr Chin Hock TOH  
Co-chair Dr Won Kyoung CHOI STATS ChipPAC Ltd, Singapore
Member Prof. Chee Lip GAN Nanyang Technological University, Singapore
Member Prof. Sungdong KIM Seoul National University of Science & Technology, Korea
Member Dr Kim Shyong SIOW University Kebangsaan Malaysia, Malaysia
Member Alvin LEE Brewer Science, Taiwan
Member Prof. Changqing LIU Loughborough University, UK
Member Dr Lim Chong SIM Intel, Malaysia
Member Prof. Chuan Seng TAN Nanyang Technological University, Singapore
Member Vempati Srinivasa RAO IME, Singapore
Member Dr Jun WEI Singapore Institute of Manufacturing Technology, Singapore
Member Chin-Yu (Max) LU Siliconware Precision Industries Ltd, Taiwan
Member Dr Suan Hui PU University of Southampton, Malaysia
New Member Yuentuck, Wu  Dupont


Equipment and Process Automation

Role Name Organisation
Chair James How Singapore
Co-chair Chandra BHESETTI Lam Research
Member  Dr He Yunbo Guangdong University of Technologies
Member  Dr Prayudi Lianto Applied Materials, Singapore
Member  LEE, CHEE PING  Lam Research

Electrical Simulations and Characterization 


Role Name Organisation
Chair Wui Weng Wong AMD, Singapore
Co-chair Mihai Rotaru U. of Southampton, U.K.
Co-chair Bruce KIM City University of New York
Member Aoyagi Masahiro AIST, Japan
Member Weerasekera Roshan University of the West of England (UWE)
Member Engin Ege San Diego State University , USA
Member Fujiang Lin USTC, China
Member Jianyong Xie  Intel, USA
Member Chetan Verma NXP, India
new Member Fei Gou AMD, Canada
Member Jackson Kong Intel, Malaysia
Member Sungho KANG Yonsei University, Korea
Member En-Xiao LIU Institute of High Performance Computing, Singapore
Mechanical Simulation and Characterization


Role Name Organisation
Chair Andrew TAY National University of Singapore, Singapore
Co-chair Shan GAO Huawei, Singapore
Member Daoguo Yang  Guilin University of Electronic Technology, China
Member Kuo Ning CHIANG National Tsing Hua University,Taiwan
Member Leo ERNST Ernst Consultant
Member Juergen Auersperg Fraunhofer ENAS, Germany
Member Wei Zhou Micron, Singapore
Member Eric Yong Infineon Technologies Asia Pacific, Singapore
Member Richard Rao Microsemi
Member Xiaowu ZHANG Institute of Microelectronics,Singapore
Member Christopher Bailey University of Greenwich, UK 
Member Rathin MANDAL Advanced Micro Devices Singapore, Singapore
New Member  Yong Liu On Semiconductor
New Member Jeff Suhling University of Auburn, USA

Thermal Characterization and Cooling Solutions



Role Name Organisation
Chair Rathin MANDAL Advanced Micro Devices Singapore, Singapore
Co-chair Marta RENCZ Mentor Graphics - MicReD, Hungary
Member Wataru NAKAYAMA Therm Tech International, Japan
Member Yogendra JOSHI Georgia Institute of Technology, USA
Member Sandeep TONAPI Anveshak Technology and Knowledge Solutions, USA
Member Justin A. WEIBEL Purdue University, USA
Member Hengyun ZHANG Shanghai University of Engineering Science, China
Member Marcin JANICKI  Lodz University of Technology, Poland
Member Yong HAN Institute of Microelectronics (A-star), Singapore
New Member Kazuyoshi FUSHINOBU Tokyo Institute of Technology, Japan
New Member Ye HONG University of Science and Technology, China
New Member Codecasa LORENZO Politecnico di Milano, Italy
New Member Pengfei LI Huawei Technologies, China

Quality, Reliability and Failure Analysis

Role Name Organisation
Chair Alfred YEO Infineon, Singapore
Co-Chair  Tong Yan TEE SMARTS Enterprise, Singapore
Member Christian BIRZER Infineon Technologies, Germany
Member Xuejun FAN Lamar University , United States
Member Yi-Shao LAI ASE, Taiwan
Member Stefano MARIANI Politecnico di Milano, Italy
Member Keith NEWMAN AMD
Member Hong Wan NG Micron, Singapore
Member Shaw Fong WONG Intel, Malaysia
Member Chin Hui CHONG Micron, Singapore
Member Lei Jun TANG A*STAR, IME,Singapore
Member Zhibin XIE Heptagon Micro Optics Pte Ltd
New Member Ai Kiar ANG IBM ,Singapore
New Member Haohui LONG Huawei Device Co.,Ltd., China
New Member Stevan G Hunter ON Semiconductor


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