Professional Development Courses
Professional Development Courses
PDC#1. Electronic Packaging for 5G Microwave and Millimeter Wave Systems IEEE by Dr. Rick Sturdivant
PDC#2. Automotive electronics – requirements and reliability by Dr. Mervi Paulasto-Kröckel
PDC#3. MEMS Fabrication: from theory to packaging by Dr. Liu Aiqun
PDC#4 .Fan-Out Wafer-Level Packaging and 3D Packaging by Dr. John H Lau
PDC#5. Reliability from a Semiconductor Suppliers Perspective by Dr. Stevan Hunter
PDC#6. Advanced LED packaging technology and reliability by Dr. Ricky Lee
Introduction to our invited speakers
MEMS Fabrication and Packaging, Dr. Liu Aiqun, School of Electrical & Electronic Engineering College of Engineering Nanyang technological university, Singapore
School of Electrical and Electronic Engineering
Nanyang Technological University (NTU)
Tel: (65)6790-4336 | Fax: (65)6793-3318
OSA Fellow, SPIE Fellow, RCS Fellow
Associate Editor, IEEE Sensors Journal
Guest Editor, Sensors & Actuators A: Physical
Electronic Packaging for 5G Microwave and Millimeter Wave Systems, Dr. Rick Sturdivant, Department of Engineering and Computer Science & Department of Engineering and Computer Science, Azusa Pacific University, USA
Dr. Rick Sturdivant is a recognized expert in the field of electronic packaging, transmit/receive modules, and phased arrays. He is coeditor of RF and Microwave Microelectronics Packaging II (Springer Publishing, 2017), coauthor of Transmit Receive Modules for Radar and Communication Systems (Artech House, 2015), coauthor of Hands On Guide To Heat Transfer For Microwave and Millimeter-wave Electronics (Amazon.com eBook, 2015), and author of Microwave and Millimeter-wave Electronic Packaging (Artech House, 2013). He has also contributed several book chapters, numerous journal papers and conference papers. He holds seven U.S. patents. From 1989 to 2000 he engineered transmit receive modules for Hughes/Raytheon where he received the engineering excellence award for developing the world’s first tile array module. Since the year 2000, he has started several successful technology companies providing solutions for wireless, microwave, millimeter-wave, and high-speed products. He is an Assistant Professor at Azusa Pacific University Founder and Chief Technology Officer of MPT, Inc. He earned the Ph.D. degree from Colorado State University, M.A. degree from Biola University, M.S.E.E. degree from the University of California at Los Angeles, B.S.E.E. degree from the California State University at Long Beach, and the B.A. degree from Vanguard University. For more up to date information, visit his website at ricksturdivant.com.
Fan-Out Wafer-Level Packaging and 3D Packaging, Dr. John H Lau, ASM, Hong Kong
Dr John H. Lau has been a Sr. Technical Advisor of ASM since July 2014. Prior to that, he was an ITRI Fellow of Industrial Technology Research Institute for 4.5 years, a visiting professor at HKUST for 1 year, the Director of MMC Laboratory with IME Singapore for 2 years and a Senior Scientist/MTS at HPLab/Agilent in California, US for more than 25 years. With more than 38 years of R&D and manufacturing experience, he has published more than 425 peer-reviewed papers, 30 issued and pending patents, and 17 textbooks on wafer-level flip chip technologies, TSV for 3D integration, advanced MEMS packaging, and reliability of 2D and 3D IC interconnections. John received many awards and is an elected ASME Fellow and has been an IEEE Fellow since 1994.
Small volume interconnect reliability and failure mechanisms for power/automotive package, Dr. Mervi Paulasto-Kröckel, Department of Electrical Engineering and Automation, Aalto University, Finland
Dr. Mervi Paulasto-Kröckel
Automotive electronics has been a reliability driver for the semiconductor devices since decades. Only mature packaging technologies has been accepted for production to make sure any reliability risks are minimized. Autonomous vehicle with its sensing and communication needs as well as e-mobility requirements will change this paradigm and new packaging technologies will be entering automotive market faster. Also, autonomous driving will increase the on-time of electronics demanding ever higher reliability components and assemblies. This presentation will review the implications of current trends to package development and reliability engineering, show examples of failure mechanisms in small volume interconnects and present methodological improvements needed to avoid reliability issues in automotive electronics packaging.
Packaging of UV Light-Emitting Diodes for Non-Lighting Applications, Dr. Shi-Wei Ricky Lee, LFASME, FIEEE, FInstP, LFIMAPS, Chair Professor of Mechanical & Aerospace Engineering, HKUST, Director of Center for Advanced Microsystems Packaging, General Director of HKUST Shenzhen Research Institute, Director of HKUST LED-FPD Technology R&D Center at Foshan
Light-emitting diodes (LED) have become the 4th generation light source since the turn of the century. In the past decade, people witnessed more and more applications of general lighting applications using LEDs. There is no doubt that solid-state lighting has become commodity in the comercial markets. Many people are wondering about what next waves of LED R&D should be focused on. Based on the speaker’s observation, there are three emerging areas worth noting, namely, UV-LED, visible light communications (VLC), and micro-LED display. All of these are for non-lighitng applications. This presentation will briefly touch on these emerging areas and then focus on UV-LED. The intention is to bring the on-going technology trend to the awareness of active researchers on LED so that they can put their resources and efforts on the hot spot. In addition to the fundamentals of UV-LED and relevant concerns in packaging, certain applications will be introduced to demonstrate the features of UV-LED which are different from conventional general lighting.