The IEEE Electronics Packaging Technology Conference (EPTC) is an annual international event organized by the IEEE RS/EPS/EDS Singapore Chapter and co-sponsored by the IEEE Electronics Packaging Society (EPS). Since its inauguration in 1997, EPTC has been established as a highly reputable international electronics packaging conference and is the IEEE EPS flagship conference in the Asia and Pacific Region. It covers the full spectrum of electronics packaging technology. Technical tracks include Advanced Packaging, TSV/Wafer Level Packaging, Interconnection Technologies, Emerging Technologies, Materials and Processing, Assembly and Manufacturing Technology, Advanced Materials and Process Manufacturing Technology, Electrical Simulation & Characterization, Mechanical Simulation & Characterization, Thermal Characterization & Management, Quality, Reliability & Failure Analysis, Advanced Optoelectronics and Displays, Smart Manufacturing and Packaging Equipment Technology. EPTC will feature keynotes, invited talks, panels, workshops, technical sessions, exhibitions, and networking activities.

Contact us: secretariat@eptc-ieee.net